MT47H32M16CC-37E L:B TR

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Mfr.Part #
MT47H32M16CC-37E L:B TR
Manufacturer
Micron Technology
Package / Case
84-TFBGA
Datasheet
Download
Description
IC DRAM 512MBIT PARALLEL 84FBGA
Stock
17,900
In Stock :
17,900

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Manufacturer :
Micron Technology
Product Category :
Memory
Supplier Device Package :
84-FBGA (12x12.5)
Clock Frequency :
267MHz
RoHS Status :
ROHS3 Compliant
Access Time :
500ps
Operating Temperature :
0°C~85°C TC
Packaging :
Tape and Reel (TR)
Base Part Number :
MT47H32M16
Write Cycle Time - Word, Page :
15ns
Mounting Type :
Surface Mount
Memory Interface :
Parallel
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
1.7V~1.9V
Published :
2008
Memory Format :
DRAM
Package / Case :
84-TFBGA
Memory Type :
Volatile
Memory Size :
512Mb 32M x 16
Introducing Memory Micron Technology MT47H32M16CC-37E L:B TR from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TC, Base Part Number:MT47H32M16, Mounting Type:Surface Mount, Package / Case:84-TFBGA, MT47H32M16CC-37E L:B TR pinout, MT47H32M16CC-37E L:B TR datasheet PDF, MT47H32M16CC-37E L:B TR amp .Beyond Memory Micron Technology MT47H32M16CC-37E L:B TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT47H32M16CC-37E L:B TR


Memory Micron Technology MT47H32M16CC-37E L:B TR Overview

The Memory Micron Technology MT47H32M16CC-37E L:B TR is a high-performance DRAM module designed by Micron Technology, one of the leading manufacturers in the memory sector. This IC DRAM module offers a robust 512Mbit capacity, ideal for applications requiring high-speed data processing and substantial storage capacity. With its advanced 84FBGA packaging, it ensures compact integration and reliable connectivity, which is crucial for both high-density and space-constrained applications. The integration of parallel architecture facilitates rapid data access and throughput, enhancing system responsiveness and efficiency.

MT47H32M16CC-37E L:B TR Features

This DRAM IC excels in performance due to several key features. It utilizes a parallel interface for fast data transfer rates, essential for high-speed computing tasks. The 84FBGA package not only minimizes the physical footprint but also enhances thermal performance, ensuring stable operation under varying environmental conditions. With a substantial storage capacity of 512Mbit, it meets the needs of complex digital systems requiring extensive data handling capabilities.

MT47H32M16CC-37E L:B TR Applications

  • Mobile Devices: Utilized in smartphones and tablets for fast app processing and improved multitasking abilities, enhancing user experience.
  • Computing Systems: Integrated into desktops and laptops to boost system speed and efficiency, particularly in handling large software applications and data-intensive tasks.
  • Embedded Systems: Employed in specialized computing systems such as digital cameras and automotive electronics, where consistent performance and reliability are critical.
  • Gaming Consoles: Used in gaming consoles to manage complex graphics and gameplay smoothly, ensuring a seamless gaming experience.
  • Networking Equipment: Essential for data centers and network switches to manage large volumes of data with reduced latency, supporting better network performance and reliability.
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Shipping Cost

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