MT40A4G4NRE-075E:B TR

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Mfr.Part #
MT40A4G4NRE-075E:B TR
Manufacturer
Micron Technology
Package / Case
78-TFBGA
Datasheet
Download
Description
IC DRAM 16GBIT PARALLEL 78FBGA
Stock
31,767
In Stock :
31,767

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Manufacturer :
Micron Technology
Product Category :
Memory
Packaging :
Tape and Reel (TR)
Memory Type :
Volatile
RoHS Status :
ROHS3 Compliant
Memory Size :
16Gb 4G x 4
Package / Case :
78-TFBGA
Clock Frequency :
1.33GHz
Memory Format :
DRAM
Operating Temperature :
0°C~95°C TC
Mounting Type :
Surface Mount
Voltage - Supply :
1.14V~1.26V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Interface :
Parallel
Introducing Memory Micron Technology MT40A4G4NRE-075E:B TR from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:78-TFBGA, Operating Temperature:0°C~95°C TC, Mounting Type:Surface Mount, MT40A4G4NRE-075E:B TR pinout, MT40A4G4NRE-075E:B TR datasheet PDF, MT40A4G4NRE-075E:B TR amp .Beyond Memory Micron Technology MT40A4G4NRE-075E:B TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT40A4G4NRE-075E:B TR


Memory Micron Technology MT40A4G4NRE-075E:B TR Overview

The Memory Micron Technology MT40A4G4NRE-075E:B TR DRAM is an advanced 16Gbit component designed for high-performance computing and large-scale data processing applications. Manufactured by Micron Technology, this IC leverages cutting-edge parallel architecture, encapsulated in a compact 78FBGA package for enhanced data transfer speed and reliability. As businesses increasingly demand more powerful and efficient memory solutions, the Memory Micron Technology MT40A4G4NRE-075E:B TR stands out as a crucial component that supports extensive multitasking and large data throughput, making it ideal for enterprise-level solutions.

MT40A4G4NRE-075E:B TR Features

This IC DRAM features a high-density 16Gbit configuration that allows for substantial scalability in system memory size. The parallel interface ensures rapid data transfer rates which are essential for high-speed computing operations. Its packaging in a 78FBGA form factor not only minimizes space on the physical board but also enhances the thermal management capabilities of the device, thereby increasing the overall reliability and performance under diverse operating conditions.

MT40A4G4NRE-075E:B TR Applications

  • Server Systems: Provides the backbone for server memory, enabling robust data management and high-speed processing for complex queries in data centers.
  • High-Performance Computing (HPC): Facilitates computational research and simulations in scientific computing environments, where massive data processing is required.
  • Cloud Storage: Acts as primary memory in cloud storage systems, enhancing data retrieval and storage operations, crucial for cloud-based applications and services.
  • Networking Equipment: Used in routers and switches, this DRAM helps manage the high-speed packet data flow essential for maintaining network integrity and speed.
  • Gaming Consoles: Enhances gaming experience by allowing faster load times and smoother gameplay, which are critical in modern gaming consoles.
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