MSP430FR5725IDA

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Mfr.Part #
MSP430FR5725IDA
Manufacturer
Texas Instruments
Package / Case
38-TSSOP (0.240, 6.10mm Width)
Datasheet
Download
Description
IC MCU 16BIT 8KB FRAM 38TSSOP
Stock
70
In Stock :
70

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Manufacturer :
Texas Instruments
Product Category :
Microcontrollers
Thickness :
1.15mm
Low Power Mode :
yes
Memory Size :
8kB
Number of I/O :
30
DMA Channels :
yes
Lead Free :
Lead Free
Data Bus Width :
16b
Surface Mount :
yes
Boundary Scan :
yes
Factory Lead Time :
6 Weeks
Packaging :
Tube
Number of SPI Channels :
3
Terminal Form :
Gull wing
Program Memory Type :
FRAM
Number of GPIO :
33
Bit Size :
16
JESD-609 Code :
e4
Data Converter :
A/D 14x10b
Supply Voltage-Min (Vsup) :
2V
Number of Pins :
38
Program Memory Size :
8KB 8K x 8
Number of Timers/Counters :
5
Number of UART Channels :
2
Number of Serial I/Os :
2
Has ADC :
yes
Height :
1.2mm
Moisture Sensitivity Level (MSL) :
2 (1 Year)
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Weight :
203.804722mg
Number of I2C Channels :
1
Frequency :
8MHz
Number of A/D Converters :
14
Base Part Number :
MSP430
Terminal Finish :
Nickel/Palladium/Gold (Ni/Pd/Au)
Core Size :
16-Bit
Integrated Cache :
0
Watchdog Timer :
yes
Lifecycle Status :
ACTIVE (Last Updated: 2 days ago)
RoHS Status :
ROHS3 Compliant
RAM (words) :
1
Length :
12.5mm
Interface :
I2C, IrDA, LIN, SCI, SPI, UART, USART
Terminal Position :
Dual
Memory Type :
FLASH, FRAM, ROMless
RAM Size :
1K x 8
PWM Channels :
yes
Supply Voltage :
3V
Pin Count :
38
Format :
FIXED-POINT
Core Processor :
CPUXV2
Radiation Hardening :
No
Number of Terminations :
38
Width :
6.2mm
DAC Channels :
No
Oscillator Type :
Internal
Mounting Type :
Surface Mount
Package / Case :
38-TSSOP (0.240, 6.10mm Width)
Series :
MSP430™ FRAM
Pbfree Code :
yes
Connectivity :
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd) :
2V~3.6V
Peak Reflow Temperature (Cel) :
260
Peripherals :
Brown-out Detect/Reset, POR, PWM, WDT
Operating Temperature :
-40°C~85°C TA
Datasheets
MSP430FR5725IDA
Introducing Microcontrollers Texas Instruments MSP430FR5725IDA from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:38, Base Part Number:MSP430, Number of Terminations:38, Mounting Type:Surface Mount, Package / Case:38-TSSOP (0.240, 6.10mm Width), Operating Temperature:-40°C~85°C TA, MSP430FR5725IDA pinout, MSP430FR5725IDA datasheet PDF, MSP430FR5725IDA amp .Beyond Microcontrollers Texas Instruments MSP430FR5725IDA ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments MSP430FR5725IDA


Microcontrollers Texas Instruments MSP430FR5725IDA Overview

The Microcontrollers Texas Instruments MSP430FR5725IDA is a highly integrated, low-power microcontroller that excels in various embedded applications due to its advanced features and efficient power management. It is built on a powerful 16-bit RISC architecture, designed specifically to enhance performance in systems where efficiency and compact programming are required. This microcontroller integrates 8KB of FRAM for data storage, which offers the advantage of faster write speeds and higher endurance compared to traditional non-volatile memory technologies. The MSP430FR5725IDA is housed in a 38-TSSOP package, making it ideal for space-constrained applications.

MSP430FR5725IDA Features

This microcontroller supports a range of features that enhance its utility in complex digital systems. These include an extensive clock system that helps in optimizing power consumption according to the application demands, multiple communication interfaces like SPI, I2C, and UART for excellent peripheral connectivity, and an analog comparator that aids in rapid response to external changes. Furthermore, it includes a 10-bit ADC, providing robust analog sensor integration to process various physical inputs.

MSP430FR5725IDA Applications

  • Smart Appliances: Utilized in smart home devices for controlling and monitoring systems, enhancing functionality and energy efficiency.
  • Wearable Health Devices: Serves as the core processing unit in wearable technology, managing data input from sensors for health monitoring.
  • Industrial Automation: Drives automation equipment in factories, improving precision and reliability while reducing power consumption.
  • Energy Management Systems: Optimizes energy usage in building management systems through effective monitoring and control.
  • Automotive Accessories: Employs in vehicle systems for better management of automotive electronics such as lighting and sensors.
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