MSC8113TMP3600V

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Mfr.Part #
MSC8113TMP3600V
Manufacturer
NXP Semiconductors
Package / Case
FCBGA
Datasheet
Download
Description
DSP TRI-CORE 431FCBGA
Stock
32,951
In Stock :
32,951

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Manufacturer :
NXP Semiconductors
Product Category :
DSP (Digital Signal Processors)
Radiation Hardening :
No
Terminal Position :
BOTTOM
Max Operating Temperature :
105°C
RoHS Status :
RoHS Compliant
Package / Case :
FCBGA
Time@Peak Reflow Temperature-Max (s) :
30
Temperature Grade :
Industrial
Supply Voltage-Min (Vsup) :
1.07V
Frequency (Max) :
300MHz
Packaging :
Bulk
Halogen Free :
Halogen Free
Number of Functions :
1
Supply Voltage-Max (Vsup) :
1.13V
Mount :
Surface Mount
Terminal Finish :
Tin/Lead/Silver (Sn/Pb/Ag)
Height Seated (Max) :
3.3mm
Pin Count :
431
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Consumer IC Type :
CONSUMER CIRCUIT
Terminal Pitch :
0.8mm
Peak Reflow Temperature (Cel) :
250
RAM Size :
1.4MB
ECCN Code :
3A991
Min Operating Temperature :
-40°C
JESD-609 Code :
e0
Frequency :
300MHz
Terminal Form :
Ball
Number of Terminations :
431
Length :
20mm
JESD-30 Code :
S-PBGA-B431
Data Bus Width :
32b
Interface :
Ethernet, I2C, UART
HTS Code :
8542.31.00.01
Datasheets
MSC8113TMP3600V
Introducing DSP (Digital Signal Processors) NXP Semiconductors MSC8113TMP3600V from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:FCBGA, Number of Terminations:431, MSC8113TMP3600V pinout, MSC8113TMP3600V datasheet PDF, MSC8113TMP3600V amp .Beyond DSP (Digital Signal Processors) NXP Semiconductors MSC8113TMP3600V ,we also offer TMS320VC5416PGE160, TMS320C6713BZDP300, ADSP-21369KBPZ-3A, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors MSC8113TMP3600V


DSP NXP Semiconductors MSC8113TMP3600V Overview

Introducing the DSP NXP Semiconductors MSC8113TMP3600V, a high-performance digital signal processor designed for sophisticated, real-time signal processing applications. This processor leverages the advanced technology of NXP Semiconductors to deliver exceptional speed and reliability, making it an ideal choice for designers looking to enhance their systems with cutting-edge DSP capabilities. With its robust architecture and versatile feature set, the MSC8113TMP3600V ensures optimal performance in demanding environments, supporting a wide range of applications from audio processing to complex radar signal management.

MSC8113TMP3600V Features

The MSC8113TMP3600V DSP features a tri-core configuration, housed within a 431FCBGA (Fine Pitch Ball Grid Array) package, ensuring efficient thermal management and a compact footprint. This DSP excels in delivering high-speed processing capabilities with reduced power consumption, a critical factor in mobile and embedded applications. Additionally, its compatibility with a broad spectrum of interfaces and peripherals enhances its adaptability, enabling seamless integration into existing technology frameworks.

MSC8113TMP3600V Applications

  • Telecommunications: Utilized in the core of network infrastructure equipment, facilitating fast and reliable signal processing for data transmission and reception.
  • Audio Processing: Enhances audio devices with capabilities for sound enhancement and active noise cancellation, providing clearer and richer sound experiences.
  • Automotive Systems: Integral to advanced driver-assistance systems (ADAS), processing sensor data to support real-time decision-making and vehicle automation.
  • Industrial Control: Deployed in control systems for real-time processing of sensor data, optimizing operations and ensuring safety in manufacturing environments.
  • Medical Imaging: Essential in the processing of complex medical imaging data, helping to deliver sharper images for diagnostic purposes.
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