MSC8103M1200F

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Mfr.Part #
MSC8103M1200F
Manufacturer
NXP Semiconductors
Package / Case
FCBGA
Datasheet
Download
Description
DSP 16BIT 300MHZ CPM 332FCBGA
Stock
20,121
In Stock :
20,121

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Manufacturer :
NXP Semiconductors
Product Category :
DSP (Digital Signal Processors)
Terminal Form :
Ball
Pin Count :
332
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Width :
17mm
ECCN Code :
3A991
Reach Compliance Code :
not_compliant
RAM (words) :
262144
Boundary Scan :
yes
External Data Bus Width :
64
Package / Case :
FCBGA
Terminal Finish :
Tin/Lead/Silver (Sn/Pb/Ag)
JESD-30 Code :
S-PBGA-B332
Number of Terminations :
332
Time@Peak Reflow Temperature-Max (s) :
30
Height Seated (Max) :
3.18mm
Supply Voltage-Min (Vsup) :
1.55V
Supply Voltage-Max (Vsup) :
1.7V
RoHS Status :
Non-RoHS Compliant
Format :
FIXED POINT
Temperature Grade :
Other
JESD-609 Code :
e0
Address Bus Width :
32
Mount :
Surface Mount
Lead Free :
Contains Lead
Terminal Pitch :
0.8mm
Terminal Position :
BOTTOM
Qualification Status :
Not Qualified
Frequency :
300MHz
Max Operating Temperature :
75°C
Barrel Shifter :
No
Low Power Mode :
yes
uPs/uCs/Peripheral ICs Type :
DIGITAL SIGNAL PROCESSOR, OTHER
HTS Code :
8542.31.00.01
Internal Bus Architecture :
Multiple
Supply Voltage :
1.6V
Min Operating Temperature :
-40°C
Bit Size :
16
Length :
17mm
Peak Reflow Temperature (Cel) :
220
Power Supplies :
1.63.3V
Datasheets
MSC8103M1200F
Introducing DSP (Digital Signal Processors) NXP Semiconductors MSC8103M1200F from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:FCBGA, Number of Terminations:332, MSC8103M1200F pinout, MSC8103M1200F datasheet PDF, MSC8103M1200F amp .Beyond DSP (Digital Signal Processors) NXP Semiconductors MSC8103M1200F ,we also offer TMS320VC5416PGE160, TMS320C6713BZDP300, ADSP-21369KBPZ-3A, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors MSC8103M1200F


DSP NXP Semiconductors MSC8103M1200F Overview

Introducing the DSP NXP Semiconductors MSC8103M1200F, a highly advanced digital signal processor that stands out in the market for its robust performance and versatility. Designed by NXP Semiconductors, a leader in semiconductor innovation, this DSP operates at a core frequency of 300MHz, which enables efficient handling and processing of digital signals in real time. The MSC8103M1200F is encapsulated in a compact 332FCBGA package, making it ideal for applications requiring a balance between power and space. This processor is perfect for businesses looking to integrate high-speed signal processing capabilities into their sophisticated systems, promising reliability and performance.

MSC8103M1200F Features

The MSC8103M1200F offers several key features that enhance its utility in digital signal processing. It boasts a 16-bit data bus that provides ample throughput for demanding applications. Its 300 MHz core frequency ensures rapid processing of data, which is crucial for time-sensitive applications. Additionally, the compact 332FCBGA package ensures that it can fit into tight spaces without sacrificing performance, making it an excellent choice for intricate electronic designs.

MSC8103M1200F Applications

  • Telecommunications Equipment: Utilizes its high-speed processing to manage and streamline signal operations, enhancing the efficiency and reliability of communications networks.
  • Audio Processing Units: Capable of handling complex audio signal processing algorithms, improving sound quality and effects in high-end audio systems.
  • Industrial Control Systems: Employs its robust processing power to oversee and manage automated processes, ensuring precise control in various industrial applications.
  • Medical Imaging Devices: Supports advanced imaging techniques by processing large volumes of data rapidly, crucial for real-time medical diagnostics and imaging systems.
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