MPC860ENCZQ66D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

RAM Controllers :

DRAM

Boundary Scan :

yes

Co-Processors/DSP :

Communications; CPM

Height Seated (Max) :

2.52mm

ECCN Code :

3A991.A.2

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Graphics Acceleration :

No

Time@Peak Reflow Temperature-Max (s) :

30

Terminal Position :

BOTTOM

Number of Terminations :

357

Additional Interfaces :

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Power Supplies :

3.3V

Supply Voltage-Max (Vsup) :

3.465V

Number of Cores/Bus Width :

1 Core 32-Bit

Packaging :

Tray

Terminal Form :

Ball

Integrated Cache :

yes

Base Part Number :

MPC860

RoHS Status :

Non-RoHS Compliant

Supply Voltage :

3.3V

Terminal Pitch :

1.27mm

Low Power Mode :

yes

External Data Bus Width :

32

Format :

FIXED POINT

Series :

MPC8xx

Length :

25mm

HTS Code :

8542.31.00.01

JESD-30 Code :

S-PBGA-B357

Factory Lead Time :

12 Weeks

JESD-609 Code :

e0

Surface Mount :

yes

Peak Reflow Temperature (Cel) :

245

Bit Size :

32

Clock Frequency :

50MHz

Speed :

66MHz

Supply Voltage-Min (Vsup) :

3.135V

Voltage - I/O :

3.3V

Operating Temperature :

-40°C~95°C TA

Address Bus Width :

32

Terminal Finish :

Tin/Lead/Silver (Sn/Pb/Ag)

Published :

1995

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Package / Case :

357-BBGA

Ethernet :

10Mbps (4)