MPC850DEZQ50BUR2

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Address Bus Width :

26

Supply Voltage :

3.3V

Series :

MPC8xx

RAM Controllers :

DRAM

Factory Lead Time :

12 Weeks

Supply Voltage-Max (Vsup) :

3.6V

RoHS Status :

Non-RoHS Compliant

Package / Case :

256-BBGA

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Boundary Scan :

yes

Number of Cores/Bus Width :

1 Core 32-Bit

Co-Processors/DSP :

Communications; CPM

External Data Bus Width :

32

Terminal Pitch :

1.27mm

Terminal Form :

Ball

JESD-30 Code :

S-PBGA-B256

Height Seated (Max) :

2.54mm

Graphics Acceleration :

No

Integrated Cache :

yes

HTS Code :

8542.31.00.01

Low Power Mode :

yes

Terminal Position :

BOTTOM

Terminal Finish :

Tin/Lead (Sn/Pb)

ECCN Code :

3A991.A.2

Time@Peak Reflow Temperature-Max (s) :

40

USB :

USB 1.x (1)

Ethernet :

10Mbps (1)

Bit Size :

32

Peak Reflow Temperature (Cel) :

260

Surface Mount :

yes

JESD-609 Code :

e0

Base Part Number :

MPC850

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Packaging :

Tape and Reel (TR)

Power Supplies :

3.3V

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Voltage - I/O :

3.3V

Operating Temperature :

0°C~95°C TA

Length :

23mm

Speed :

50MHz

Supply Voltage-Min (Vsup) :

3V

Number of Terminations :

256

Format :

FIXED POINT

Published :

1997