MPC850DEZQ50BUR2

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Package / Case :

256-BBGA

USB :

USB 1.x (1)

Voltage - I/O :

3.3V

Ethernet :

10Mbps (1)

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

External Data Bus Width :

32

Height Seated (Max) :

2.54mm

Power Supplies :

3.3V

Low Power Mode :

yes

HTS Code :

8542.31.00.01

Bit Size :

32

Factory Lead Time :

12 Weeks

JESD-609 Code :

e0

ECCN Code :

3A991.A.2

Terminal Finish :

Tin/Lead (Sn/Pb)

Packaging :

Tape and Reel (TR)

Terminal Position :

BOTTOM

Operating Temperature :

0°C~95°C TA

Peak Reflow Temperature (Cel) :

260

Length :

23mm

Address Bus Width :

26

JESD-30 Code :

S-PBGA-B256

Number of Cores/Bus Width :

1 Core 32-Bit

Co-Processors/DSP :

Communications; CPM

Integrated Cache :

yes

Boundary Scan :

yes

Published :

1997

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Graphics Acceleration :

No

Supply Voltage :

3.3V

Series :

MPC8xx

Terminal Form :

Ball

Terminal Pitch :

1.27mm

Number of Terminations :

256

Speed :

50MHz

Time@Peak Reflow Temperature-Max (s) :

40

Format :

FIXED POINT

RAM Controllers :

DRAM

Supply Voltage-Max (Vsup) :

3.6V

RoHS Status :

Non-RoHS Compliant

Supply Voltage-Min (Vsup) :

3V

Surface Mount :

yes

Base Part Number :

MPC850

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC