MPC850DEZQ50BUR2

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Height Seated (Max) :

2.54mm

Time@Peak Reflow Temperature-Max (s) :

40

JESD-30 Code :

S-PBGA-B256

Length :

23mm

ECCN Code :

3A991.A.2

Voltage - I/O :

3.3V

Terminal Finish :

Tin/Lead (Sn/Pb)

Address Bus Width :

26

Number of Cores/Bus Width :

1 Core 32-Bit

Co-Processors/DSP :

Communications; CPM

Package / Case :

256-BBGA

Boundary Scan :

yes

Bit Size :

32

RoHS Status :

Non-RoHS Compliant

Low Power Mode :

yes

Speed :

50MHz

Base Part Number :

MPC850

Terminal Pitch :

1.27mm

Ethernet :

10Mbps (1)

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Supply Voltage-Min (Vsup) :

3V

Format :

FIXED POINT

Supply Voltage :

3.3V

Packaging :

Tape and Reel (TR)

Series :

MPC8xx

Peak Reflow Temperature (Cel) :

260

Supply Voltage-Max (Vsup) :

3.6V

External Data Bus Width :

32

Number of Terminations :

256

Surface Mount :

yes

USB :

USB 1.x (1)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

JESD-609 Code :

e0

HTS Code :

8542.31.00.01

Published :

1997

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Integrated Cache :

yes

Power Supplies :

3.3V

Terminal Form :

Ball

Operating Temperature :

0°C~95°C TA

Graphics Acceleration :

No

Factory Lead Time :

12 Weeks

Terminal Position :

BOTTOM

RAM Controllers :

DRAM