MPC555LFMZP40

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Core Size :

32-Bit

Qualification Status :

Not Qualified

Height Seated (Max) :

2.65mm

PWM Channels :

yes

ECCN Code :

3A991.A.2

Supply Voltage-Min (Vsup) :

3V

Terminal Position :

BOTTOM

Clock Frequency :

20MHz

Bit Size :

32

Terminal Form :

Ball

Time@Peak Reflow Temperature-Max (s) :

30

Supply Voltage :

3.3V

Mounting Type :

Surface Mount

RoHS Status :

Non-RoHS Compliant

Core Processor :

PowerPC

Connectivity :

CANbus, EBI/EMI, SCI, SPI, UART/USART

Published :

1998

Address Bus Width :

24

Peak Reflow Temperature (Cel) :

235

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Number of I/O :

101

Terminal Finish :

Tin/Lead (Sn/Pb)

Program Memory Type :

Flash

Speed :

40MHz

DMA Channels :

No

Oscillator Type :

External

DAC Channels :

No

Terminal Pitch :

1.27mm

Width :

27mm

Additional Feature :

ALSO REQUIRES 5V SUPPLY

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Package / Case :

272-BBGA

Packaging :

Tray

External Data Bus Width :

32

Surface Mount :

yes

Program Memory Size :

448KB 448K x 8

Peripherals :

POR, PWM, WDT

RAM Size :

26K x 8

Number of Terminations :

272

Operating Temperature :

-40°C~125°C TA

Series :

MPC5xx

Supply Voltage-Max (Vsup) :

3.6V

HTS Code :

8542.31.00.01

Base Part Number :

MPC555

Length :

27mm

JESD-609 Code :

e0

Voltage - Supply (Vcc/Vdd) :

2.7V~5.5V

Data Converter :

A/D 32x10b

JESD-30 Code :

S-PBGA-B272

Has ADC :

yes