MK52DN512CMD10

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Core Size :

32-Bit

Terminal Form :

Ball

Time@Peak Reflow Temperature-Max (s) :

40

Data Converter :

A/D 41x16b; D/A 2x12b

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

RoHS Status :

ROHS3 Compliant

ROM (words) :

524288

RAM Size :

128K x 8

Peak Reflow Temperature (Cel) :

260

Surface Mount :

yes

Operating Temperature :

-40°C~85°C TA

JESD-609 Code :

e1

Number of I/O :

96

Terminal Finish :

TIN SILVER COPPER

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Factory Lead Time :

13 Weeks

Package / Case :

144-LBGA

Width :

13mm

Peripherals :

DMA, I2S, LVD, POR, PWM, WDT

Published :

2011

DAC Channels :

yes

DMA Channels :

yes

Base Part Number :

MK52DN512

PWM Channels :

yes

Terminal Pitch :

1mm

Bit Size :

32

Length :

13mm

Terminal Position :

BOTTOM

Speed :

100MHz

Qualification Status :

Not Qualified

Clock Frequency :

50MHz

Mounting Type :

Surface Mount

Power Supplies :

1.8/3.3V

Supply Voltage-Min (Vsup) :

1.71V

Supply Voltage :

3.3V

Series :

Kinetis K50

Number of Terminations :

144

Has ADC :

yes

HTS Code :

8542.31.00.01

Packaging :

Tray

Supply Voltage-Max (Vsup) :

3.6V

JESD-30 Code :

S-PBGA-B144

Core Processor :

ARM® Cortex®-M4

Connectivity :

EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG

Program Memory Type :

Flash

Oscillator Type :

Internal

Program Memory Size :

512KB 512K x 8

CPU Family :

CORTEX-M4

ECCN Code :

3A991.A.2