MK51DN512CMD10

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Packaging :

Tray

Qualification Status :

Not Qualified

Power Supplies :

1.8/3.3V

DMA Channels :

yes

Bit Size :

32

Number of I/O :

94

Core Size :

32-Bit

Surface Mount :

yes

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

ROM (words) :

524288

Base Part Number :

MK51DN512

Program Memory Type :

Flash

Terminal Form :

Ball

Peripherals :

DMA, I2S, PWM, WDT

PWM Channels :

yes

Supply Voltage :

3.3V

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Clock Frequency :

32MHz

Peak Reflow Temperature (Cel) :

260

Terminal Pitch :

1mm

Published :

2002

ECCN Code :

3A991.A.2

Mounting Type :

Surface Mount

Time@Peak Reflow Temperature-Max (s) :

40

Program Memory Size :

512KB 512K x 8

Has ADC :

yes

Supply Voltage-Min (Vsup) :

1.71V

Number of Terminations :

144

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Operating Temperature :

-40°C~85°C TA

DAC Channels :

yes

JESD-30 Code :

S-PBGA-B144

Length :

13mm

Core Processor :

ARM® Cortex®-M4

Data Converter :

A/D 41x16b; D/A 2x12b

Supply Current-Max :

77mA

JESD-609 Code :

e1

Speed :

100MHz

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

RAM Size :

128K x 8

Terminal Position :

BOTTOM

Package / Case :

144-LBGA

Factory Lead Time :

13 Weeks

Width :

13mm

CPU Family :

CORTEX-M4

Height Seated (Max) :

1.7mm

HTS Code :

8542.31.00.01

Series :

Kinetis K50

Oscillator Type :

Internal

Supply Voltage-Max (Vsup) :

3.6V

RoHS Status :

ROHS3 Compliant