MK26FN2M0VMI18

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Mfr.Part #
MK26FN2M0VMI18
Manufacturer
NXP Semiconductors
Package / Case
169-LFBGA
Datasheet
Download
Description
IC MCU 32BIT 2MB FLASH 169MAPBGA
Stock
1,079
In Stock :
1,079

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Terminal Pitch :
0.65mm
Package / Case :
169-LFBGA
Voltage - Supply (Vcc/Vdd) :
1.71V~3.6V
Power Supplies :
1.8/3.3V
Published :
2002
Packaging :
Tray
PWM Channels :
yes
ECCN Code :
3A991.A.2
DMA Channels :
yes
Speed :
180MHz
RoHS Status :
ROHS3 Compliant
Program Memory Size :
2MB 2M x 8
Terminal Position :
BOTTOM
RAM (bytes) :
262144
Clock Frequency :
50MHz
Has ADC :
yes
Bit Size :
32
RAM Size :
256K x 8
Number of Terminations :
169
CPU Family :
CORTEX-M4F
Peripherals :
DMA, I2S, LVD, POR, PWM, WDT
Operating Temperature :
-40°C~105°C TA
Program Memory Type :
Flash
Width :
9mm
Qualification Status :
Not Qualified
Series :
Kinetis K20
Length :
9mm
Connectivity :
I²C, IrDA, LINbus, SPI, UART/USART
Terminal Form :
Ball
Mounting Type :
Surface Mount
Supply Voltage :
3.3V
HTS Code :
8542.31.00.01
Data Converter :
A/D 5x12b, 6x16b; D/A 2x12b
Supply Voltage-Max (Vsup) :
3.6V
DAC Channels :
yes
Number of I/O :
116
Surface Mount :
yes
Core Processor :
ARM® Cortex®-M4
Supply Voltage-Min (Vsup) :
1.71V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Core Size :
32-Bit
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
JESD-30 Code :
S-PBGA-B169
Factory Lead Time :
13 Weeks
Oscillator Type :
Internal
ROM (words) :
2097152
Supply Current-Max :
115.08mA
Datasheets
MK26FN2M0VMI18
Introducing Microcontrollers NXP Semiconductors MK26FN2M0VMI18 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:169-LFBGA, Number of Terminations:169, Operating Temperature:-40°C~105°C TA, Mounting Type:Surface Mount, MK26FN2M0VMI18 pinout, MK26FN2M0VMI18 datasheet PDF, MK26FN2M0VMI18 amp .Beyond Microcontrollers NXP Semiconductors MK26FN2M0VMI18 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors MK26FN2M0VMI18


Microcontrollers NXP Semiconductors MK26FN2M0VMI18 Overview

The Microcontrollers NXP Semiconductors MK26FN2M0VMI18 is a state-of-the-art microcontroller unit (MCU) that embodies cutting-edge technology suitable for a myriad of applications requiring high performance and reliability. This MCU, part of NXP's Kinetis K series, is built on the ARM Cortex-M4 core, offering exceptional processing power, which makes it an ideal choice for complex digital systems. With its robust 2MB of flash memory and extensive integration features, the MK26FN2M0VMI18 is designed to meet the evolving demands of modern embedded systems.

MK26FN2M0VMI18 Features

The MK26FN2M0VMI18 MCU is packed with features that enhance its efficiency and utility in demanding applications. It operates at a frequency of up to 180 MHz, providing ample power for intensive processing tasks. The MCU also includes a Floating Point Unit (FPU) that accelerates high-precision computations, critical for scientific and industrial applications. Furthermore, it supports multiple communication interfaces, including Ethernet, USB, and CAN, facilitating versatile connectivity options. Its package in a 169-MAPBGA ensures compactness and ease of integration into various hardware environments.

MK26FN2M0VMI18 Applications

  • Industrial Automation: Utilized in controlling machinery and processes in industries due to its high processing power and real-time operation capabilities.
  • Medical Devices: Acts as a central controller in medical monitoring systems owing to its reliability and the ability to process complex algorithms for real-time analysis.
  • Automotive Applications: Suitable for use in automotive control systems, benefiting from its robust architecture and support for multiple communication standards.
  • Consumer Electronics: Powers a range of consumer electronics, including gaming consoles and smart home devices, where performance and energy efficiency are crucial.
  • Communication Systems: Deployed in communication infrastructure, enhancing connectivity and data throughput capabilities with its advanced peripherals.
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