MCIMX6X3CVO08AB

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Ethernet :

10/100/1000Mbps (2)

External Data Bus Width :

32

Peak Reflow Temperature (Cel) :

260

USB :

USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)

Security Features :

A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE

Terminal Form :

Ball

Voltage - I/O :

1.8V 2.5V 2.8V 3.15V

RoHS Status :

ROHS3 Compliant

Surface Mount :

yes

JESD-30 Code :

S-PBGA-B400

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Package / Case :

400-LFBGA

Core Processor :

ARM® Cortex®-A9, ARM® Cortex®-M4

HTS Code :

8542.31.00.01

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Display & Interface Controllers :

Keypad, LCD

Supply Voltage-Max (Vsup) :

1.5V

Address Bus Width :

15

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Series :

i.MX6SX

Low Power Mode :

yes

Factory Lead Time :

15 Weeks

Packaging :

Tray

Co-Processors/DSP :

Multimedia; NEON™ MPE

Published :

2013

Time@Peak Reflow Temperature-Max (s) :

40

Supply Voltage-Min (Vsup) :

1.275V

Number of Terminations :

400

Length :

17mm

Number of Cores/Bus Width :

2 Core 32-Bit

Speed :

200MHz, 800MHz

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

JESD-609 Code :

e1

Additional Interfaces :

AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART

Terminal Pitch :

0.8mm

Operating Temperature :

-40°C~105°C TA

Height Seated (Max) :

1.53mm

Graphics Acceleration :

yes

Integrated Cache :

yes

Boundary Scan :

yes

ECCN Code :

5A992

Terminal Position :

BOTTOM

Format :

Floating Point