MCIMX6X3CVO08AB

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Position :

BOTTOM

Number of Cores/Bus Width :

2 Core 32-Bit

Package / Case :

400-LFBGA

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Length :

17mm

Integrated Cache :

yes

Time@Peak Reflow Temperature-Max (s) :

40

Surface Mount :

yes

Address Bus Width :

15

JESD-609 Code :

e1

Boundary Scan :

yes

Speed :

200MHz, 800MHz

Published :

2013

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

ECCN Code :

5A992

Height Seated (Max) :

1.53mm

Low Power Mode :

yes

Core Processor :

ARM® Cortex®-A9, ARM® Cortex®-M4

Format :

Floating Point

HTS Code :

8542.31.00.01

Terminal Form :

Ball

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

JESD-30 Code :

S-PBGA-B400

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Peak Reflow Temperature (Cel) :

260

Supply Voltage-Min (Vsup) :

1.275V

Number of Terminations :

400

Graphics Acceleration :

yes

Display & Interface Controllers :

Keypad, LCD

USB :

USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)

Voltage - I/O :

1.8V 2.5V 2.8V 3.15V

Operating Temperature :

-40°C~105°C TA

Supply Voltage-Max (Vsup) :

1.5V

Packaging :

Tray

External Data Bus Width :

32

RoHS Status :

ROHS3 Compliant

Ethernet :

10/100/1000Mbps (2)

Co-Processors/DSP :

Multimedia; NEON™ MPE

Terminal Pitch :

0.8mm

Security Features :

A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE

Series :

i.MX6SX

Factory Lead Time :

15 Weeks

Additional Interfaces :

AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART