MCIMX6QP6AVT8AA

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Additional Interfaces :

CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART

Supply Voltage-Max (Vsup) :

1.5V

SATA :

SATA 3Gbps (1)

Number of I/O :

7

RoHS Status :

ROHS3 Compliant

Factory Lead Time :

15 Weeks

USB :

USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)

Series :

i.MX6QP

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Operating Temperature :

-40°C~125°C TJ

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

Bus Compatibility :

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

Height Seated (Max) :

2.16mm

Boundary Scan :

yes

Surface Mount :

yes

Security Features :

ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

External Data Bus Width :

64

Terminal Position :

BOTTOM

Core Processor :

ARM® Cortex®-A9

Package / Case :

624-FBGA, FCBGA

Terminal Form :

Ball

Ethernet :

10/100/1000Mbps (1)

Packaging :

Tray

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

RAM (words) :

512000

JESD-30 Code :

S-PBGA-B624

Published :

2002

Number of Terminations :

624

ECCN Code :

5A992

Time@Peak Reflow Temperature-Max (s) :

40

Address Bus Width :

16

Display & Interface Controllers :

HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel

Terminal Pitch :

0.8mm

Supply Voltage-Min (Vsup) :

1.225V

Number of Cores/Bus Width :

4 Core 32-Bit

HTS Code :

8542.31.00.01

Graphics Acceleration :

yes

RAM Controllers :

LPDDR2, DDR3L, DDR3

Speed :

852MHz

JESD-609 Code :

e1

Peak Reflow Temperature (Cel) :

260

Length :

21mm