MCIMX6DP6AVT8AB

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Supply Voltage-Min (Vsup) :

1.225V

Time@Peak Reflow Temperature-Max (s) :

40

Height Seated (Max) :

2.16mm

Supply Voltage-Max (Vsup) :

1.5V

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

USB :

USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

Display & Interface Controllers :

HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel

Factory Lead Time :

12 Weeks

JESD-30 Code :

S-PBGA-B624

Surface Mount :

yes

Ethernet :

10/100/1000Mbps (1)

Series :

i.MX6DP

Additional Interfaces :

CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART

Number of Cores/Bus Width :

2 Core 32-Bit

Number of Terminations :

624

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

HTS Code :

8542.31.00.01

Terminal Form :

Ball

Terminal Position :

BOTTOM

Operating Temperature :

-40°C~125°C TJ

Length :

21mm

Graphics Acceleration :

yes

Published :

2002

SATA :

SATA 3Gbps (1)

Packaging :

Tray

Core Processor :

ARM® Cortex®-A9

Peak Reflow Temperature (Cel) :

260

Package / Case :

624-FBGA, FCBGA

Speed :

852MHz

RoHS Status :

ROHS3 Compliant

Terminal Pitch :

0.8mm

Security Features :

ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

RAM Controllers :

LPDDR2, DDR3L, DDR3

Co-Processors/DSP :

Multimedia; NEON™ SIMD