MCIMX6D5EZK08AD

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Address Bus Width :

26

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Package / Case :

569-LFBGA

Height Seated (Max) :

1.25mm

Supply Voltage-Min (Vsup) :

1.275V

Series :

i.MX6D

Format :

FIXED POINT

Peak Reflow Temperature (Cel) :

260

RAM Controllers :

LPDDR2, LVDDR3, DDR3

External Data Bus Width :

32

HTS Code :

8542.31.00.01

JESD-30 Code :

S-PBGA-B569

Display & Interface Controllers :

Keypad, LCD

USB :

USB 2.0 + PHY (4)

Number of Terminations :

569

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

Factory Lead Time :

15 Weeks

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Time@Peak Reflow Temperature-Max (s) :

40

Terminal Form :

Ball

Packaging :

Tray

Operating Temperature :

-20°C~105°C TJ

Integrated Cache :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

RoHS Status :

ROHS3 Compliant

Graphics Acceleration :

yes

Surface Mount :

yes

Low Power Mode :

yes

Speed :

800MHz

Terminal Position :

BOTTOM

Boundary Scan :

yes

Terminal Pitch :

0.4mm

Number of Cores/Bus Width :

2 Core 32-Bit

Length :

12mm

Additional Interfaces :

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

ECCN Code :

5A992

Supply Voltage :

1.4V

Published :

2002

Ethernet :

10/100/1000Mbps (1)

Security Features :

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

JESD-609 Code :

e1

Core Processor :

ARM® Cortex®-A9

Supply Voltage-Max (Vsup) :

1.5V

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

SATA :

SATA 3Gbps (1)