MCF5275LCVM166

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Time@Peak Reflow Temperature-Max (s) :

40

Factory Lead Time :

12 Weeks

Operating Temperature :

-40°C~85°C TA

Boundary Scan :

yes

Integrated Cache :

yes

Speed :

166MHz

Packaging :

Tray

Width :

15mm

Program Memory Type :

ROMless

Supply Voltage-Max (Vsup) :

1.6V

Supply Voltage :

1.5V

Mounting Type :

Surface Mount

Core Processor :

Coldfire V2

Package / Case :

196-LBGA

Length :

15mm

Height Seated (Max) :

1.6mm

Surface Mount :

yes

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Form :

Ball

Format :

FIXED POINT

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Terminal Pitch :

1mm

Clock Frequency :

83MHz

Terminal Finish :

Tin/Silver/Copper - with Nickel barrier

External Data Bus Width :

32

Low Power Mode :

yes

Terminal Position :

BOTTOM

JESD-30 Code :

S-PBGA-B196

Published :

1997

ECCN Code :

5A002.A.1

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

HTS Code :

8542.31.00.01

Voltage - Supply (Vcc/Vdd) :

1.4V~1.6V

Peak Reflow Temperature (Cel) :

260

Peripherals :

DMA, WDT

Bit Size :

32

RAM Size :

64K x 8

Number of Terminations :

196

Series :

MCF527x

Base Part Number :

MCF5275

Additional Feature :

ALSO REQUIRES 3.3V SUPPLY

Supply Voltage-Min (Vsup) :

1.4V

Number of I/O :

61

Qualification Status :

Not Qualified

RoHS Status :

ROHS3 Compliant

Address Bus Width :

24

Core Size :

32-Bit

Oscillator Type :

External