MCF5272VF66R2

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Address Bus Width :

23

RoHS Status :

Non-RoHS Compliant

Number of I/O :

32

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Integrated Cache :

yes

Surface Mount :

yes

Boundary Scan :

yes

Qualification Status :

Not Qualified

Core Processor :

Coldfire V2

Length :

15mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

JESD-30 Code :

S-PBGA-B196

Packaging :

Tape and Reel (TR)

RAM Size :

1K x 32

Terminal Pitch :

1mm

Supply Voltage :

3.3V

Oscillator Type :

External

Format :

FIXED POINT

Terminal Position :

BOTTOM

Bit Size :

32

Published :

2000

Supply Voltage-Max (Vsup) :

3.6V

Peak Reflow Temperature (Cel) :

220

Terminal Finish :

TIN LEAD

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Mounting Type :

Surface Mount

ECCN Code :

3A991.A.2

Program Memory Type :

ROM

Factory Lead Time :

10 Weeks

Core Size :

32-Bit

Package / Case :

196-LBGA

HTS Code :

8542.31.00.01

Number of Terminations :

196

Voltage - Supply (Vcc/Vdd) :

3V~3.6V

Peripherals :

DMA, WDT

Speed :

66MHz

JESD-609 Code :

e0

Program Memory Size :

16KB 4K x 32

Height Seated (Max) :

1.75mm

Clock Frequency :

66MHz

Terminal Form :

Ball

Series :

MCF527x

Base Part Number :

MCF5272

External Data Bus Width :

32

Low Power Mode :

yes

Time@Peak Reflow Temperature-Max (s) :

30

Operating Temperature :

0°C~70°C TA

Supply Voltage-Min (Vsup) :

3V

Width :

15mm