MC9S12XEP100MVL

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage-Max (Vsup) :

1.98V

Additional Feature :

IT ALSO REQUIRES 5 V I/O SUPPLY

Oscillator Type :

External

RAM Size :

64K x 8

Published :

2012

EEPROM Size :

4K x 8

Power Supplies :

3.3/5V

ECCN Code :

3A991.A.2

Peak Reflow Temperature (Cel) :

260

Qualification Status :

Not Qualified

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

Height Seated (Max) :

2mm

PWM Channels :

yes

Address Bus Width :

23

Width :

17mm

Operating Temperature :

-40°C~125°C TA

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

DMA Channels :

yes

Core Size :

16-Bit

Program Memory Type :

Flash

Clock Frequency :

40MHz

Data Converter :

A/D 32x12b

Terminal Form :

Ball

Length :

17mm

External Data Bus Width :

16

DAC Channels :

No

Time@Peak Reflow Temperature-Max (s) :

40

RoHS Status :

ROHS3 Compliant

Speed :

50MHz

HTS Code :

8542.31.00.01

Package / Case :

208-BGA

Supply Voltage :

1.8V

Surface Mount :

yes

JESD-30 Code :

S-PBGA-B208

Number of I/O :

152

Mounting Type :

Surface Mount

Series :

HCS12X

Base Part Number :

MC9S12XEP100

CPU Family :

CPU12

Packaging :

Tray

Factory Lead Time :

16 Weeks

Has ADC :

yes

Bit Size :

32

Peripherals :

LVD, POR, PWM, WDT

Terminal Pitch :

1mm

ROM (words) :

1048576

Number of Terminations :

208

Program Memory Size :

1MB 1M x 8

Voltage - Supply (Vcc/Vdd) :

1.72V~5.5V

Supply Voltage-Min (Vsup) :

1.72V

Terminal Finish :

TIN COPPER/TIN SILVER

JESD-609 Code :

e2

Terminal Position :

BOTTOM