MC9S12XEP100CVL

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Packaging :

Tray

PWM Channels :

yes

Peripherals :

LVD, POR, PWM, WDT

Terminal Pitch :

1mm

Supply Voltage-Min (Vsup) :

1.72V

Address Bus Width :

23

JESD-609 Code :

e2

ECCN Code :

3A991.A.2

Power Supplies :

3.3/5V

Speed :

50MHz

Factory Lead Time :

16 Weeks

Package / Case :

208-BGA

Has ADC :

yes

RAM Size :

64K x 8

RoHS Status :

ROHS3 Compliant

External Data Bus Width :

16

ROM (words) :

1048576

Published :

2012

Length :

17mm

Surface Mount :

yes

HTS Code :

8542.31.00.01

Qualification Status :

Not Qualified

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Height Seated (Max) :

2mm

Time@Peak Reflow Temperature-Max (s) :

40

Data Converter :

A/D 32x12b

Operating Temperature :

-40°C~85°C TA

Base Part Number :

MC9S12XEP100

JESD-30 Code :

S-PBGA-B208

CPU Family :

CPU12

Program Memory Size :

1MB 1M x 8

DAC Channels :

No

EEPROM Size :

4K x 8

Voltage - Supply (Vcc/Vdd) :

1.72V~5.5V

Number of I/O :

152

DMA Channels :

yes

Peak Reflow Temperature (Cel) :

260

Oscillator Type :

External

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Width :

17mm

Terminal Form :

Ball

Program Memory Type :

Flash

Core Size :

16-Bit

Number of Terminations :

208

Terminal Finish :

TIN COPPER/TIN SILVER

Supply Voltage-Max (Vsup) :

1.98V

Additional Feature :

IT ALSO REQUIRES 5 V I/O SUPPLY

Series :

HCS12X

Mounting Type :

Surface Mount

Clock Frequency :

40MHz

Terminal Position :

BOTTOM

Supply Voltage :

1.8V

Bit Size :

32