MC9S12XEP100CVL

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Time@Peak Reflow Temperature-Max (s) :

40

EEPROM Size :

4K x 8

Oscillator Type :

External

Power Supplies :

3.3/5V

Surface Mount :

yes

Terminal Finish :

TIN COPPER/TIN SILVER

Base Part Number :

MC9S12XEP100

External Data Bus Width :

16

Voltage - Supply (Vcc/Vdd) :

1.72V~5.5V

Factory Lead Time :

16 Weeks

Packaging :

Tray

Supply Voltage-Max (Vsup) :

1.98V

Terminal Form :

Ball

Data Converter :

A/D 32x12b

Series :

HCS12X

Program Memory Size :

1MB 1M x 8

Package / Case :

208-BGA

Number of I/O :

152

RoHS Status :

ROHS3 Compliant

ECCN Code :

3A991.A.2

Core Size :

16-Bit

CPU Family :

CPU12

Clock Frequency :

40MHz

Terminal Position :

BOTTOM

Supply Voltage-Min (Vsup) :

1.72V

Mounting Type :

Surface Mount

Peripherals :

LVD, POR, PWM, WDT

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

ROM (words) :

1048576

JESD-609 Code :

e2

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

RAM Size :

64K x 8

DAC Channels :

No

Peak Reflow Temperature (Cel) :

260

Terminal Pitch :

1mm

Supply Voltage :

1.8V

Qualification Status :

Not Qualified

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Additional Feature :

IT ALSO REQUIRES 5 V I/O SUPPLY

Address Bus Width :

23

DMA Channels :

yes

Length :

17mm

Speed :

50MHz

Has ADC :

yes

Height Seated (Max) :

2mm

Bit Size :

32

Number of Terminations :

208

Published :

2012

Width :

17mm

Program Memory Type :

Flash

JESD-30 Code :

S-PBGA-B208

Operating Temperature :

-40°C~85°C TA

PWM Channels :

yes

HTS Code :

8542.31.00.01