MC9S12E256CPVE

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Mfr.Part #
MC9S12E256CPVE
Manufacturer
NXP Semiconductors
Package / Case
112-LQFP
Datasheet
Download
Description
IC MCU 16BIT 256KB FLASH 112LQFP
Stock
3,960
In Stock :
3,960

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Supply Current-Max :
65mA
ROM (words) :
262144
Qualification Status :
Not Qualified
RAM Size :
16K x 8
Terminal Pitch :
0.65mm
Terminal Finish :
MATTE TIN
DAC Channels :
yes
Supply Voltage-Min (Vsup) :
2.35V
Program Memory Size :
256KB 256K x 8
Package / Case :
112-LQFP
HTS Code :
8542.31.00.01
Core Size :
16-Bit
Bit Size :
16
Has ADC :
yes
Power Supplies :
2.53.3/5V
JESD-30 Code :
S-PQFP-G112
Base Part Number :
MC9S12E256
Factory Lead Time :
10 Weeks
Operating Temperature :
-40°C~85°C TA
Oscillator Type :
Internal
ECCN Code :
EAR99
Peak Reflow Temperature (Cel) :
260
JESD-609 Code :
e3
Mounting Type :
Surface Mount
Terminal Position :
QUAD
Program Memory Type :
Flash
CPU Family :
CPU12
Number of Terminations :
112
Address Bus Width :
16
Terminal Form :
Gull wing
Voltage - Supply (Vcc/Vdd) :
2.35V~2.75V
Supply Voltage :
2.5V
Number of I/O :
91
Width :
20mm
Series :
HCS12
Surface Mount :
yes
Clock Frequency :
16MHz
Packaging :
Tray
Additional Feature :
ALSO REQUIRES 3.3V OR 5V SUPPLY
PWM Channels :
yes
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
DMA Channels :
No
Peripherals :
POR, PWM, WDT
Length :
20mm
RoHS Status :
ROHS3 Compliant
Time@Peak Reflow Temperature-Max (s) :
40
Speed :
25MHz
External Data Bus Width :
16
Data Converter :
A/D 16x10b; D/A 2x8b
Supply Voltage-Max (Vsup) :
2.75V
Connectivity :
EBI/EMI, I2C, SCI, SPI
Published :
2006
Height Seated (Max) :
1.6mm
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Datasheets
MC9S12E256CPVE
Introducing Microcontrollers NXP Semiconductors MC9S12E256CPVE from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:112-LQFP, Base Part Number:MC9S12E256, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Number of Terminations:112, MC9S12E256CPVE pinout, MC9S12E256CPVE datasheet PDF, MC9S12E256CPVE amp .Beyond Microcontrollers NXP Semiconductors MC9S12E256CPVE ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors MC9S12E256CPVE


Microcontrollers NXP Semiconductors MC9S12E256CPVE Overview

The Microcontrollers NXP Semiconductors MC9S12E256CPVE is an advanced microcontroller unit (MCU) designed to meet the rigorous demands of sophisticated embedded systems. This product, featuring a 16-bit architecture and equipped with 256KB of flash memory, is optimized for performance and reliability in a variety of applications. Its integration in a 112-LQFP package allows for a compact footprint while providing ample I/O capabilities for complex digital interactions. Ideal for engineers and developers looking for a robust MCU solution, the Microcontrollers NXP Semiconductors MC9S12E256CPVE offers a blend of efficiency, flexibility, and power, making it a prime choice for bulk purchases by B2B customers.

MC9S12E256CPVE Features

The MC9S12E256CPVE boasts a comprehensive set of features that enhance its utility in demanding applications. Key features include a 16-bit HCS12 core, 256KB of flash memory for extensive program storage, and advanced interrupt capabilities. Additionally, this MCU supports multiple communication protocols, including CAN, SPI, and I2C, facilitating easy integration into existing systems. Enhanced with robust security features and a broad operating temperature range, it ensures reliable operation even in harsh environments.

MC9S12E256CPVE Applications

  • Automotive Control Systems: Utilizes its CAN and SPI bus interfaces for communication within automotive networks, enhancing vehicle performance and safety.
  • Industrial Automation: The robust processing power and multiple I/O options are ideal for managing complex automation tasks in manufacturing processes.
  • Consumer Electronics: Employs its flexible memory architecture and low power consumption to optimize the functionality and efficiency of household smart devices.
  • Medical Devices: Ensures high reliability and precision for critical medical monitoring and diagnostic equipment in healthcare settings.
  • Aerospace: Provides the necessary computational capabilities and environmental resilience required in aerospace applications, including navigation and control systems.
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