MC9S12DG256VPVE

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Supply Voltage :

2.5V

Supply Voltage-Max (Vsup) :

2.75V

Operating Temperature :

-40°C~105°C TA

PWM Channels :

yes

Published :

1996

Surface Mount :

yes

Address Bus Width :

19

Factory Lead Time :

10 Weeks

Number of I/O :

91

Program Memory Size :

256KB 256K x 8

Number of Terminations :

112

Program Memory Type :

Flash

Speed :

25MHz

JESD-30 Code :

S-PQFP-G112

Series :

HCS12

Mounting Type :

Surface Mount

HTS Code :

8542.31.00.01

Packaging :

Tray

RAM Size :

12K x 8

CPU Family :

CPU12

Core Size :

16-Bit

Supply Current-Max :

65mA

Bit Size :

16

RoHS Status :

ROHS3 Compliant

Oscillator Type :

Internal

External Data Bus Width :

16

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

Peripherals :

PWM, WDT

Has ADC :

yes

Terminal Form :

Gull wing

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

ROM (words) :

262144

Base Part Number :

MC9S12DG256

Data Converter :

A/D 16x10b

Power Supplies :

2.55V

DAC Channels :

No

Supply Voltage-Min (Vsup) :

2.35V

Terminal Position :

QUAD

Terminal Finish :

Matte Tin (Sn)

Width :

20mm

Time@Peak Reflow Temperature-Max (s) :

40

Height Seated (Max) :

1.6mm

Clock Frequency :

16MHz

Length :

20mm

JESD-609 Code :

e3

DMA Channels :

No

Peak Reflow Temperature (Cel) :

260

Voltage - Supply (Vcc/Vdd) :

2.35V~5.25V

Terminal Pitch :

0.65mm

EEPROM Size :

4K x 8

Package / Case :

112-LQFP

Additional Feature :

ALSO REQUIRES 5V SUPPLY

Qualification Status :

Not Qualified