MC9S12C32MPBE25

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

RAM Size :

2K x 8

Packaging :

Tray

Connectivity :

CANbus, EBI/EMI, SCI, SPI

Oscillator Type :

Internal

RoHS Status :

ROHS3 Compliant

PWM Channels :

yes

Terminal Finish :

MATTE TIN

Terminal Form :

Gull wing

DMA Channels :

No

ECCN Code :

EAR99

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Number of I/O :

35

Bit Size :

16

JESD-609 Code :

e3

Time@Peak Reflow Temperature-Max (s) :

40

Clock Frequency :

50MHz

Published :

2005

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

Mounting Type :

Surface Mount

Length :

10mm

Operating Temperature :

-40°C~125°C TA

Voltage - Supply (Vcc/Vdd) :

2.35V~5.5V

Package / Case :

52-LQFP

DAC Channels :

No

Has ADC :

yes

Core Size :

16-Bit

Supply Voltage :

2.5V

Base Part Number :

MC9S12C32

Terminal Position :

QUAD

Width :

10mm

HTS Code :

8542.31.00.01

Speed :

25MHz

Peak Reflow Temperature (Cel) :

260

Series :

HCS12

Terminal Pitch :

0.65mm

Peripherals :

POR, PWM, WDT

Height Seated (Max) :

1.7mm

JESD-30 Code :

S-PQFP-G52

Supply Voltage-Max (Vsup) :

2.75V

Program Memory Type :

Flash

Program Memory Size :

32KB 32K x 8

Surface Mount :

yes

Data Converter :

A/D 8x10b

Address Bus Width :

16

External Data Bus Width :

16

Number of Terminations :

52

Factory Lead Time :

10 Weeks