MC9S08SH8MTJR

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Peak Reflow Temperature (Cel) :

260

Supply Current-Max :

7.7mA

Width :

4.4mm

DMA Channels :

No

PWM Channels :

yes

Program Memory Type :

Flash

JESD-30 Code :

R-PDSO-G20

Mounting Type :

Surface Mount

Supply Voltage-Min (Vsup) :

2.7V

RAM (bytes) :

512

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

JESD-609 Code :

e3

Number of Terminations :

20

Data Converter :

A/D 12x10b

Time@Peak Reflow Temperature-Max (s) :

40

Published :

2007

Package / Case :

20-TSSOP (0.173, 4.40mm Width)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Surface Mount :

yes

Supply Voltage :

3V

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

Bit Size :

8

Program Memory Size :

8KB 8K x 8

HTS Code :

8542.31.00.01

Terminal Position :

Dual

DAC Channels :

No

Terminal Pitch :

0.65mm

Terminal Form :

Gull wing

Qualification Status :

Not Qualified

Series :

S08

Height Seated (Max) :

1.2mm

Operating Temperature :

-40°C~125°C TA

Packaging :

Tape and Reel (TR)

Supply Voltage-Max (Vsup) :

5.5V

Factory Lead Time :

22 Weeks

Speed :

40MHz

Voltage - Supply (Vcc/Vdd) :

2.7V~5.5V

Length :

6.5mm

RAM Size :

512 x 8

Core Size :

8-Bit

Power Supplies :

3/5V

Terminal Finish :

Matte Tin (Sn)

ROM (words) :

8192

Clock Frequency :

16MHz

Number of I/O :

17

RoHS Status :

ROHS3 Compliant

Has ADC :

yes

ECCN Code :

3A991.A.2

Peripherals :

LVD, POR, PWM, WDT

Oscillator Type :

Internal