MC68L11E1CFNE2

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

EEPROM Size :

512 x 8

Mounting Type :

Surface Mount

Voltage - Supply (Vcc/Vdd) :

3V~5.5V

Core Size :

8-Bit

Packaging :

Tube

Operating Temperature :

-40°C~85°C TA

Address Bus Width :

16

RoHS Status :

ROHS3 Compliant

Has ADC :

yes

DAC Channels :

No

Connectivity :

SCI, SPI

Supply Voltage :

5V

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

PWM Channels :

No

Supply Voltage-Min (Vsup) :

4.5V

Bit Size :

8

Package / Case :

52-LCC (J-Lead)

Program Memory Type :

ROMless

Terminal Finish :

MATTE TIN

JESD-609 Code :

e3

Surface Mount :

yes

Terminal Form :

J BEND

Peak Reflow Temperature (Cel) :

250

Peripherals :

POR, WDT

Supply Voltage-Max (Vsup) :

5.5V

External Data Bus Width :

8

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Height Seated (Max) :

4.57mm

ECCN Code :

EAR99

Qualification Status :

Not Qualified

Length :

19.125mm

DMA Channels :

No

Base Part Number :

MC68L11

HTS Code :

8542.31.00.01

Time@Peak Reflow Temperature-Max (s) :

30

Data Converter :

A/D 8x8b

Speed :

2MHz

Terminal Position :

QUAD

Width :

19.125mm

Number of Terminations :

52

Oscillator Type :

Internal

Published :

2005

JESD-30 Code :

S-PQCC-J52

Terminal Pitch :

1.27mm

Series :

HC11

RAM Size :

512 x 8

Number of I/O :

38

Clock Frequency :

8MHz