MC68HC11E1MFNE3

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Data Converter :

A/D 8x8b

Terminal Pitch :

1.27mm

External Data Bus Width :

8

Series :

HC11

Operating Temperature :

-40°C~125°C TA

Terminal Position :

QUAD

DAC Channels :

No

Surface Mount :

yes

Base Part Number :

MC68HC11

JESD-30 Code :

S-PQCC-J52

Published :

2016

JESD-609 Code :

e3

RAM Size :

512 x 8

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Time@Peak Reflow Temperature-Max (s) :

40

Peripherals :

POR, WDT

HTS Code :

8542.31.00.01

Clock Frequency :

12MHz

Connectivity :

SCI, SPI

Packaging :

Tube

Speed :

3MHz

Mounting Type :

Surface Mount

Core Size :

8-Bit

Supply Voltage-Min (Vsup) :

4.5V

Terminal Finish :

Matte Tin (Sn)

Length :

19.125mm

Bit Size :

8

DMA Channels :

No

ECCN Code :

EAR99

Additional Feature :

SEATED HEIGHT CALCULATED

Program Memory Type :

ROMless

Supply Voltage-Max (Vsup) :

5.5V

EEPROM Size :

512 x 8

Peak Reflow Temperature (Cel) :

260

Terminal Form :

J BEND

Factory Lead Time :

17 Weeks

Number of I/O :

38

Address Bus Width :

16

Has ADC :

yes

Width :

19.125mm

Package / Case :

52-LCC (J-Lead)

Voltage - Supply (Vcc/Vdd) :

4.5V~5.5V

Height Seated (Max) :

5.08mm

RoHS Status :

ROHS3 Compliant

Number of Terminations :

52

Supply Voltage :

5V

PWM Channels :

No

Oscillator Type :

Internal

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER