MC68HC11E1CFNE3R

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

DAC Channels :

No

Program Memory Type :

ROMless

Packaging :

Tape and Reel (TR)

Series :

HC11

RAM Size :

512 x 8

Connectivity :

SCI, SPI

Package / Case :

52-LCC (J-Lead)

Terminal Position :

QUAD

Terminal Finish :

Matte Tin (Sn)

Peak Reflow Temperature (Cel) :

260

Number of I/O :

38

Height Seated (Max) :

5.08mm

RoHS Status :

ROHS3 Compliant

Address Bus Width :

16

Supply Voltage-Max (Vsup) :

5.5V

Width :

19.125mm

JESD-609 Code :

e3

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

JESD-30 Code :

S-PQCC-J52

Speed :

3MHz

Published :

1999

PWM Channels :

No

Length :

19.125mm

DMA Channels :

No

Clock Frequency :

12MHz

Voltage - Supply (Vcc/Vdd) :

4.5V~5.5V

EEPROM Size :

512 x 8

Supply Voltage-Min (Vsup) :

4.5V

Base Part Number :

MC68HC11

Terminal Pitch :

1.27mm

Has ADC :

yes

Number of Terminations :

52

Bit Size :

8

Surface Mount :

yes

Peripherals :

POR, WDT

Mounting Type :

Surface Mount

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

ECCN Code :

EAR99

Supply Voltage :

5V

Oscillator Type :

Internal

External Data Bus Width :

8

Additional Feature :

SEATED HEIGHT CALCULATED

Data Converter :

A/D 8x8b

Terminal Form :

J BEND

HTS Code :

8542.31.00.01

Time@Peak Reflow Temperature-Max (s) :

40

Operating Temperature :

-40°C~85°C TA

Core Size :

8-Bit