MC68F375BGMZP33

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Base Part Number :

MC68F375

Package / Case :

217-BBGA

Time@Peak Reflow Temperature-Max (s) :

30

JESD-609 Code :

e0

Terminal Finish :

Tin/Lead (Sn/Pb)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Address Bus Width :

24

Data Converter :

A/D 16x10b

Peak Reflow Temperature (Cel) :

220

Terminal Form :

Ball

RAM Size :

10K x 8

DMA Channels :

No

Operating Temperature :

-40°C~125°C TA

Connectivity :

CANbus, SPI, UART/USART

Surface Mount :

yes

Supply Voltage :

3.3V

Packaging :

Tray

Factory Lead Time :

16 Weeks

Terminal Position :

BOTTOM

Speed :

33MHz

JESD-30 Code :

S-PBGA-B217

Number of Terminations :

217

Number of I/O :

48

Supply Voltage-Max (Vsup) :

3.6V

ECCN Code :

3A991.A.2

Series :

M683xx

PWM Channels :

yes

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

DAC Channels :

yes

Has ADC :

yes

Peripherals :

POR, PWM, WDT

Core Processor :

CPU32

Clock Frequency :

33.6MHz

Published :

1996

Oscillator Type :

Internal

Supply Voltage-Min (Vsup) :

3V

Voltage - Supply (Vcc/Vdd) :

3V~5.25V

HTS Code :

8542.31.00.01

Bit Size :

32

Program Memory Type :

Flash

Mounting Type :

Surface Mount

Core Size :

32-Bit

Program Memory Size :

256KB 256K x 8

External Data Bus Width :

16

RoHS Status :

Non-RoHS Compliant