MC56F8365MFGE

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Time@Peak Reflow Temperature-Max (s) :

40

HTS Code :

8542.31.00.01

Base Part Number :

MC56F8365

Terminal Finish :

Matte Tin (Sn)

ECCN Code :

3A991.A.2

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Operating Temperature :

-40°C~125°C TA

Barrel Shifter :

yes

Peak Reflow Temperature (Cel) :

260

Format :

FIXED POINT

Terminal Form :

Gull wing

Length :

20mm

Low Power Mode :

yes

Data Converter :

A/D 16x12b

Terminal Pitch :

0.5mm

Supply Voltage-Max (Vsup) :

2.75V

Internal Bus Architecture :

Multiple

RoHS Status :

ROHS3 Compliant

Surface Mount :

yes

Oscillator Type :

External

Width :

14mm

Additional Feature :

ALSO REQUIRES 3.3V SUPPLY

Program Memory Type :

Flash

ROM (words) :

524288

uPs/uCs/Peripheral ICs Type :

DIGITAL SIGNAL PROCESSOR, OTHER

Terminal Position :

QUAD

Mounting Type :

Surface Mount

Qualification Status :

Not Qualified

Core Size :

16-Bit

Number of I/O :

49

Voltage - Supply (Vcc/Vdd) :

2.25V~3.6V

RAM Size :

18K x 16

Factory Lead Time :

10 Weeks

Supply Voltage :

2.5V

JESD-30 Code :

R-PQFP-G128

Number of Terminations :

128

Core Processor :

56800E

Clock Frequency :

120MHz

Connectivity :

CANbus, EBI/EMI, SCI, SPI

Speed :

60MHz

JESD-609 Code :

e3

Height Seated (Max) :

1.6mm

Bit Size :

16

Program Memory Size :

512KB 256K x 16

External Data Bus Width :

4

Supply Voltage-Min (Vsup) :

2.25V

Package / Case :

128-LQFP

Address Bus Width :

11

Boundary Scan :

yes

Peripherals :

POR, PWM, Temp Sensor, WDT

Power Supplies :

2.53.3V

Published :

1998

Series :

56F8xxx

Packaging :

Tray