MC56F8355MFGE

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Clock Frequency :

120MHz

Surface Mount :

yes

Supply Voltage :

2.5V

Data Converter :

A/D 16x12b

Operating Temperature :

-40°C~125°C TA

RAM Size :

10K x 16

ECCN Code :

3A991.A.2

Barrel Shifter :

yes

Height Seated (Max) :

1.6mm

Connectivity :

CANbus, EBI/EMI, SCI, SPI

Length :

20mm

Time@Peak Reflow Temperature-Max (s) :

40

Qualification Status :

Not Qualified

HTS Code :

8542.31.00.01

Series :

56F8xxx

Program Memory Type :

Flash

Supply Voltage-Min (Vsup) :

2.25V

Number of Terminations :

128

Terminal Position :

QUAD

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Base Part Number :

MC56F8355

Internal Bus Architecture :

Multiple

Speed :

60MHz

Format :

FIXED POINT

Bit Size :

16

Address Bus Width :

11

Voltage - Supply (Vcc/Vdd) :

2.25V~3.6V

Terminal Finish :

Matte Tin (Sn)

Width :

14mm

Supply Voltage-Max (Vsup) :

2.75V

Mounting Type :

Surface Mount

ROM (words) :

262144

Published :

1998

Peak Reflow Temperature (Cel) :

260

Oscillator Type :

External

Core Size :

16-Bit

External Data Bus Width :

4

Factory Lead Time :

10 Weeks

RoHS Status :

ROHS3 Compliant

Number of I/O :

49

uPs/uCs/Peripheral ICs Type :

DIGITAL SIGNAL PROCESSOR, OTHER

Peripherals :

POR, PWM, Temp Sensor, WDT

JESD-30 Code :

R-PQFP-G128

Terminal Pitch :

0.5mm

Program Memory Size :

256KB 128K x 16

Low Power Mode :

yes

Boundary Scan :

yes

Packaging :

Tray

Terminal Form :

Gull wing

JESD-609 Code :

e3

Additional Feature :

ALSO REQUIRES 3.3V SUPPLY

Package / Case :

128-LQFP

Power Supplies :

2.53.3V

Core Processor :

56800E