MC56F8165VFGE

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Connectivity :

EBI/EMI, SCI, SPI

Power Supplies :

2.53.3V

Time@Peak Reflow Temperature-Max (s) :

40

JESD-609 Code :

e3

Data Converter :

A/D 16x12b

Mounting Type :

Surface Mount

Terminal Position :

QUAD

Qualification Status :

Not Qualified

Width :

14mm

Clock Frequency :

120MHz

Length :

20mm

Format :

FIXED POINT

Height Seated (Max) :

1.6mm

Surface Mount :

yes

Series :

56F8xxx

Number of Terminations :

128

Barrel Shifter :

yes

uPs/uCs/Peripheral ICs Type :

DIGITAL SIGNAL PROCESSOR, OTHER

Boundary Scan :

yes

ROM (words) :

524288

Internal Bus Architecture :

Multiple

Peripherals :

POR, PWM, WDT

Oscillator Type :

External

Speed :

40MHz

Core Processor :

56800E

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Number of I/O :

49

HTS Code :

8542.31.00.01

Package / Case :

128-LQFP

Terminal Pitch :

0.5mm

Additional Feature :

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width :

11

Packaging :

Tray

Voltage - Supply (Vcc/Vdd) :

2.25V~3.6V

Peak Reflow Temperature (Cel) :

260

Operating Temperature :

-40°C~105°C TA

Supply Voltage-Min (Vsup) :

2.25V

ECCN Code :

3A991.A.2

Low Power Mode :

yes

Terminal Form :

Gull wing

JESD-30 Code :

R-PQFP-G128

Bit Size :

16

Base Part Number :

MC56F8165

Supply Voltage-Max (Vsup) :

2.75V

RAM Size :

16K x 16

Factory Lead Time :

10 Weeks

Supply Voltage :

2.5V

Published :

1998

External Data Bus Width :

4

Core Size :

16-Bit

Program Memory Type :

Flash

Program Memory Size :

512KB 256K x 16

RoHS Status :

ROHS3 Compliant

Terminal Finish :

Matte Tin (Sn)