M2S090-1FCSG325
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- Mfr.Part #
- M2S090-1FCSG325
- Manufacturer
- Microchip Technology
- Package / Case
- 325-TFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 325BGA
- Stock
- 36,603
- In Stock ：
- 36,603
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Terminal Pitch :
- 0.5mm
- Speed :
- 166MHz
- Length :
- 13.5mm
- Packaging :
- Tray
- Qualification Status :
- Not Qualified
- Number of Inputs :
- 180
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- HTS Code :
- 8542.39.00.01
- Number of I/O :
- 180
- Flash Size :
- 512kB
- Number of Outputs :
- 180
- JESD-609 Code :
- e3
- Terminal Position :
- BOTTOM
- Package / Case :
- 325-TFBGA, CSPBGA
- Supply Voltage :
- 1.2V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Power Supplies :
- 1.2V
- Surface Mount :
- yes
- Supply Voltage-Min (Vsup) :
- 1.14V
- RoHS Status :
- RoHS Compliant
- Series :
- SmartFusion®2
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Operating Temperature :
- 0°C~85°C TJ
- Number of Terminations :
- 325
- Number of Logic Cells :
- 86316
- Terminal Form :
- Ball
- Supply Voltage-Max (Vsup) :
- 1.26V
- Additional Feature :
- LG-MIN, WD-MIN
- RAM Size :
- 64KB
- Peripherals :
- DDR, PCIe, SERDES
- Terminal Finish :
- MATTE TIN
- JESD-30 Code :
- R-PBGA-B325
- Core Processor :
- ARM® Cortex®-M3
- Height Seated (Max) :
- 1.16mm
- Width :
- 11mm
- Factory Lead Time :
- 10 Weeks
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Primary Attributes :
- FPGA - 90K Logic Modules
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 3 weeks ago)
- Architecture :
- MCU, FPGA
- Datasheets
- M2S090-1FCSG325
325 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 180 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor(s) ARM® Cortex®-M3 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 325-TFBGA, CSPBGA.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion®2 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.This SoC security combines FPGA - 90K Logic Modules, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.180 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.If it has at least a 1.14V volt power supply, it can work fine.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.In total, there are 325 terminations, so system on a chip is really aided by this.There is the option to have 180 outputs on this SoC chip.As far as power supplies are concerned, system on chip requires 1.2V.Inputs are available on the SoC chip in the number of 180.There are 86316 logic cells in the logic system on chips.The flash size of the SoC meaning is 512KB.Moreover, this SoC processor also includes LG-MIN, WD-MIN as its additional features.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S090-1FCSG325 System On Chip (SoC) applications.
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
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