M2S005-1VF256I
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- Mfr.Part #
- M2S005-1VF256I
- Manufacturer
- Microchip Technology
- Package / Case
- 256-LFBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 256FBGA
- Stock
- 45,306
- In Stock ：
- 45,306
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Core Processor :
- ARM® Cortex®-M3
- Number of Logic Cells :
- 6060
- Number of Inputs :
- 161
- JESD-30 Code :
- S-PBGA-B256
- Width :
- 14mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Height Seated (Max) :
- 1.56mm
- Terminal Position :
- BOTTOM
- Reach Compliance Code :
- not_compliant
- Number of Outputs :
- 161
- HTS Code :
- 8542.39.00.01
- Length :
- 14mm
- Series :
- SmartFusion®2
- Terminal Pitch :
- 0.8mm
- Supply Voltage-Max (Vsup) :
- 1.26V
- RoHS Status :
- Non-RoHS Compliant
- Power Supplies :
- 1.2V
- Terminal Form :
- Ball
- RAM Size :
- 64KB
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Packaging :
- Tray
- Factory Lead Time :
- 10 Weeks
- Speed :
- 166MHz
- Published :
- 2015
- Flash Size :
- 128kB
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Terminations :
- 256
- JESD-609 Code :
- e0
- Peripherals :
- DDR
- Supply Voltage :
- 1.2V
- Supply Voltage-Min (Vsup) :
- 1.14V
- Operating Temperature :
- -40°C~100°C TJ
- Package / Case :
- 256-LFBGA
- Qualification Status :
- Not Qualified
- Number of I/O :
- 161
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 3 weeks ago)
- Additional Feature :
- LG-MIN, WD-MIN
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Primary Attributes :
- FPGA - 5K Logic Modules
- Architecture :
- MCU, FPGA
- Surface Mount :
- yes
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Datasheets
- M2S005-1VF256I
256 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 161 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
On this SoC, there is ARM® Cortex®-M3 core processor.Assigned with the package 256-LFBGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion®2 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 5K Logic Modules.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 161 I/Os.It is recommended to use a 1.2V power supply.In the SoCs wireless, voltages above 1.26V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.In total, there are 256 terminations, which is great for system on a chip.There are 161 outputs available on this SoC.A power supply of 1.2V is required to run system on chip.On the SoC chip, there are 161 inputs available for use.Logic system on chips consist of 6060 logic cells.There is a flash of 128KB on it.Further features of this SoC processor are LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S005-1VF256I System On Chip (SoC) applications.
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
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