M2S060TS-FG676
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- Mfr.Part #
- M2S060TS-FG676
- Manufacturer
- Microchip Technology
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 676FBGA
- Stock
- 46,726
- In Stock ：
- 46,726
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Width :
- 27mm
- Operating Temperature :
- -40°C~100°C TJ
- HTS Code :
- 8542.39.00.01
- Architecture :
- MCU, FPGA
- Number of Terminations :
- 676
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage-Min (Vsup) :
- 1.14V
- Primary Attributes :
- FPGA - 60K Logic Modules
- Factory Lead Time :
- 10 Weeks
- Speed :
- 166MHz
- Series :
- SmartFusion®2
- Height Seated (Max) :
- 2.44mm
- RoHS Status :
- Non-RoHS Compliant
- Published :
- 2015
- Reach Compliance Code :
- not_compliant
- Flash Size :
- 256KB
- Qualification Status :
- Not Qualified
- Length :
- 27mm
- Number of I/O :
- 387
- Terminal Position :
- BOTTOM
- Terminal Form :
- Ball
- JESD-30 Code :
- S-PBGA-B676
- Supply Voltage-Max (Vsup) :
- 1.26V
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Number of Outputs :
- 387
- Number of Logic Cells :
- 56520
- RAM Size :
- 64KB
- Power Supplies :
- 1.2V
- Packaging :
- Tray
- Supply Voltage :
- 1.2V
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Core Processor :
- ARM® Cortex®-M3
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Peripherals :
- DDR, PCIe, SERDES
- Package / Case :
- 676-BGA
- Surface Mount :
- yes
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of Inputs :
- 387
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 3 weeks ago)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Pitch :
- 1mm
- JESD-609 Code :
- e0
- Datasheets
- M2S060TS-FG676
676 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 387 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 676-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 60K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.387 I/Os are included in this SoC part.A 1.2V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.At least 1.14V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 676 terminations, which makes system on a chip possible.A SoC chip with 387 outputs is available.A power supply of 1.2V is required.A SoC chip with 387 inputs is available.A logic SoC has 56520 logic cells.A 256KB flash can be seen on it.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060TS-FG676I System On Chip (SoC) applications.
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
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