M2S060TS-1FCSG325
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- Mfr.Part #
- M2S060TS-1FCSG325
- Manufacturer
- Microchip Technology
- Package / Case
- 325-TFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 325BGA
- Stock
- 30,991
- In Stock ：
- 30,991
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Finish :
- MATTE TIN
- JESD-609 Code :
- e3
- Supply Voltage-Min (Vsup) :
- 1.14V
- Number of Logic Cells :
- 56520
- Number of Inputs :
- 200
- Core Processor :
- ARM® Cortex®-M3
- Package / Case :
- 325-TFBGA, CSPBGA
- Flash Size :
- 256KB
- Series :
- SmartFusion®2
- Packaging :
- Tray
- Number of Outputs :
- 200
- RAM Size :
- 64KB
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Pitch :
- 0.5mm
- Published :
- 2015
- HTS Code :
- 8542.39.00.01
- Surface Mount :
- yes
- Peripherals :
- DDR, PCIe, SERDES
- Terminal Position :
- BOTTOM
- Supply Voltage :
- 1.2V
- Length :
- 11mm
- Number of Terminations :
- 325
- Architecture :
- MCU, FPGA
- Operating Temperature :
- 0°C~85°C TJ
- Supply Voltage-Max (Vsup) :
- 1.26V
- Height Seated (Max) :
- 1.01mm
- Number of I/O :
- 200
- Speed :
- 166MHz
- Primary Attributes :
- FPGA - 60K Logic Modules
- Qualification Status :
- Not Qualified
- JESD-30 Code :
- S-PBGA-B325
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 3 weeks ago)
- Terminal Form :
- Ball
- Power Supplies :
- 1.2V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- RoHS Status :
- RoHS Compliant
- Factory Lead Time :
- 10 Weeks
- Additional Feature :
- LG-MIN, WD-MIN
- Width :
- 11mm
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Datasheets
- M2S060TS-1FCSG325
325 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor ARM® Cortex®-M3 is used to build this SoC.Its package is 325-TFBGA, CSPBGA.A 64KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion®2 series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 60K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 200.A 1.2V power supply should be used.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.Having 325 terminations in total makes system on a chip possible.It is possible to use this SoC chip with 200 outputs.You will need to provide 1.2V power supplies in order to run system on chip.A SoC chip with 200 inputs is available to the user.56520 logic cells are included in logic system on chips.There is a flash of 256KB.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S060TS-1FCSG325 System On Chip (SoC) applications.
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
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