M2S060TS-1FCS325I

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Mfr.Part #
M2S060TS-1FCS325I
Manufacturer
Microchip Technology
Package / Case
325-TFBGA, CSPBGA
Datasheet
Download
Description
IC SOC CORTEX-M3 166MHZ 325BGA
Stock
26,593
In Stock :
26,593

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Manufacturer :
Microchip Technology
Product Category :
System On Chip (SoC)
Terminal Pitch :
0.5mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Packaging :
Tray
JESD-609 Code :
e0
Supply Voltage-Min (Vsup) :
1.14V
Connectivity :
CANbus, Ethernet, I2C, SPI, UART/USART, USB
HTS Code :
8542.39.00.01
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Speed :
166MHz
Core Processor :
ARM® Cortex®-M3
Height Seated (Max) :
1.01mm
Primary Attributes :
FPGA - 60K Logic Modules
Terminal Position :
BOTTOM
Width :
11mm
Package / Case :
325-TFBGA, CSPBGA
Flash Size :
256KB
Length :
11mm
Surface Mount :
yes
Operating Temperature :
-40°C~100°C TJ
RAM Size :
64KB
Lifecycle Status :
IN PRODUCTION (Last Updated: 3 weeks ago)
Number of Terminations :
325
JESD-30 Code :
S-PBGA-B325
Architecture :
MCU, FPGA
Series :
SmartFusion®2
Pbfree Code :
No
Additional Feature :
LG-MIN, WD-MIN
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of I/O :
200
Factory Lead Time :
10 Weeks
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
RoHS Status :
Non-RoHS Compliant
Peripherals :
DDR, PCIe, SERDES
Terminal Finish :
Tin/Lead (Sn/Pb)
Published :
2015
Supply Voltage :
1.2V
Supply Voltage-Max (Vsup) :
1.26V
Terminal Form :
Ball
Reach Compliance Code :
not_compliant
Datasheets
M2S060TS-1FCS325I
Introducing System On Chip (SoC) Microchip Technology M2S060TS-1FCS325I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:325-TFBGA, CSPBGA, Operating Temperature:-40°C~100°C TJ, Number of Terminations:325, M2S060TS-1FCS325I pinout, M2S060TS-1FCS325I datasheet PDF, M2S060TS-1FCS325I amp .Beyond System On Chip (SoC) Microchip Technology M2S060TS-1FCS325I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology M2S060TS-1FCS325I


325 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V

This SoC is built on ARM® Cortex®-M3 core processor(s).


A core processor ARM® Cortex®-M3 is embedded in this SoC.It has been assigned a package 325-TFBGA, CSPBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion®2 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines FPGA - 60K Logic Modules and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 200 I/Os in total.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.As a result, there are 325 terminations in total, which does really benefit system on a chip.This flash has a size of 256KB.Moreover, this SoC processor is also equipped with additional features of LG-MIN, WD-MIN.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN


There are a lot of Microsemi Corporation


M2S060TS-1FCS325I System On Chip (SoC) applications.


  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
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