M2S060T-FG676I
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- Mfr.Part #
- M2S060T-FG676I
- Manufacturer
- Microchip Technology
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 676FBGA
- Stock
- 47,212
- In Stock ：
- 47,212
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Package / Case :
- 676-BGA
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 3 weeks ago)
- Number of Terminations :
- 676
- Terminal Form :
- Ball
- Terminal Position :
- BOTTOM
- RAM Size :
- 64KB
- Operating Temperature :
- -40°C~100°C TJ
- RoHS Status :
- Non-RoHS Compliant
- Peripherals :
- DDR, PCIe, SERDES
- Number of Logic Cells :
- 56520
- Power Supplies :
- 1.2V
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Surface Mount :
- yes
- Factory Lead Time :
- 10 Weeks
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Length :
- 27mm
- Width :
- 27mm
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Terminal Pitch :
- 1mm
- Supply Voltage-Min (Vsup) :
- 1.14V
- Supply Voltage :
- 1.2V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- HTS Code :
- 8542.39.00.01
- Core Processor :
- ARM® Cortex®-M3
- JESD-30 Code :
- S-PBGA-B676
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Qualification Status :
- Not Qualified
- Series :
- SmartFusion®2
- Supply Voltage-Max (Vsup) :
- 1.26V
- Published :
- 2015
- Reach Compliance Code :
- not_compliant
- Height Seated (Max) :
- 2.44mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of I/O :
- 387
- JESD-609 Code :
- e0
- Flash Size :
- 256KB
- Speed :
- 166MHz
- Architecture :
- MCU, FPGA
- Primary Attributes :
- FPGA - 60K Logic Modules
- Number of Outputs :
- 387
- Packaging :
- Tray
- Number of Inputs :
- 387
- Datasheets
- M2S060T-FG676I
676 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 387 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 676-BGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion®2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 60K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 387 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.14V, it should be able to function.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 676 terminations.This SoC chip is capable of having 387 outputs, which is convenient.There is 1.2V power supply requirement for this system on chip SoC.The SoC chip offers 387 inputs.System on chips of logic are comprised of 56520 logic cells.This flash has a size of 256KB.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060T-FG676I System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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