M2S060T-FG676

Manufacturer :

Microchip Technology

Product Category :

System On Chip (SoC)

HTS Code :

8542.39.00.01

Qualification Status :

Not Qualified

Peripherals :

DDR, PCIe, SERDES

Supply Voltage-Max (Vsup) :

1.26V

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Programmable Logic Type :

FIELD PROGRAMMABLE GATE ARRAY

Factory Lead Time :

10 Weeks

Terminal Form :

Ball

Primary Attributes :

FPGA - 60K Logic Modules

Height Seated (Max) :

2.44mm

Surface Mount :

yes

Terminal Pitch :

1mm

Power Supplies :

1.2V

Architecture :

MCU, FPGA

JESD-609 Code :

e0

Lifecycle Status :

IN PRODUCTION (Last Updated: 3 weeks ago)

Number of Logic Cells :

56520

Package / Case :

676-BGA

Operating Temperature :

0°C~85°C TJ

Published :

2015

RoHS Status :

Non-RoHS Compliant

Width :

27mm

Reach Compliance Code :

not_compliant

Flash Size :

256KB

Core Processor :

ARM® Cortex®-M3

Supply Voltage :

1.2V

Speed :

166MHz

RAM Size :

64KB

Supply Voltage-Min (Vsup) :

1.14V

Terminal Position :

BOTTOM

Number of Outputs :

387

Number of Terminations :

676

Series :

SmartFusion®2

Length :

27mm

Packaging :

Tray

Number of Inputs :

387

JESD-30 Code :

S-PBGA-B676

Terminal Finish :

Tin/Lead (Sn/Pb)

Connectivity :

CANbus, Ethernet, I2C, SPI, UART/USART, USB

Number of I/O :

387