M2S060T-FCS325

Manufacturer :

Microchip Technology

Product Category :

System On Chip (SoC)

Width :

11mm

Terminal Finish :

Tin/Lead (Sn/Pb)

Number of Terminations :

325

HTS Code :

8542.39.00.01

Connectivity :

CANbus, Ethernet, I2C, SPI, UART/USART, USB

Number of Outputs :

200

Additional Feature :

LG-MIN, WD-MIN

Architecture :

MCU, FPGA

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Core Processor :

ARM® Cortex®-M3

Power Supplies :

1.2V

Supply Voltage-Max (Vsup) :

1.26V

Height Seated (Max) :

1.01mm

Series :

SmartFusion®2

JESD-30 Code :

S-PBGA-B325

Package / Case :

325-TFBGA, CSPBGA

Surface Mount :

yes

Operating Temperature :

0°C~85°C TJ

Terminal Position :

BOTTOM

Number of I/O :

200

RoHS Status :

Non-RoHS Compliant

Speed :

166MHz

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Primary Attributes :

FPGA - 60K Logic Modules

Qualification Status :

Not Qualified

JESD-609 Code :

e0

Factory Lead Time :

10 Weeks

Terminal Form :

Ball

Peripherals :

DDR, PCIe, SERDES

Reach Compliance Code :

not_compliant

Programmable Logic Type :

FIELD PROGRAMMABLE GATE ARRAY

Length :

11mm

RAM Size :

64KB

Number of Logic Cells :

56520

Terminal Pitch :

0.5mm

Flash Size :

256KB

Published :

2015

Packaging :

Tray

Number of Inputs :

200

Supply Voltage :

1.2V

Lifecycle Status :

IN PRODUCTION (Last Updated: 3 weeks ago)

Supply Voltage-Min (Vsup) :

1.14V