M2S060T-1FGG676

Manufacturer :

Microchip Technology

Product Category :

System On Chip (SoC)

Package / Case :

676-BGA

Operating Temperature :

0°C~85°C TJ

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Terminal Pitch :

1mm

Number of Terminations :

676

Speed :

166MHz

Peripherals :

DDR, PCIe, SERDES

JESD-30 Code :

S-PBGA-B676

RAM Size :

64KB

Number of Inputs :

387

JESD-609 Code :

e3

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Supply Voltage-Min (Vsup) :

1.14V

Terminal Form :

Ball

Number of Outputs :

387

Supply Voltage-Max (Vsup) :

1.26V

Number of I/O :

387

Primary Attributes :

FPGA - 60K Logic Modules

Core Processor :

ARM® Cortex®-M3

Connectivity :

CANbus, Ethernet, I2C, SPI, UART/USART, USB

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Number of Logic Cells :

56520

Factory Lead Time :

10 Weeks

Flash Size :

256KB

Series :

SmartFusion®2

Terminal Finish :

MATTE TIN

Packaging :

Tray

Programmable Logic Type :

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status :

Not Qualified

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Supply Voltage :

1.2V

HTS Code :

8542.39.00.01

Terminal Position :

BOTTOM

Power Supplies :

1.2V

Surface Mount :

yes

Width :

27mm

RoHS Status :

RoHS Compliant

Architecture :

MCU, FPGA

Height Seated (Max) :

2.44mm

Length :

27mm