M2S060T-1FCSG325I
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- Mfr.Part #
- M2S060T-1FCSG325I
- Manufacturer
- Microchip Technology
- Package / Case
- 325-TFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 325BGA
- Stock
- 1,483
- In Stock ：
- 1,483
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- HTS Code :
- 8542.39.00.01
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage-Min (Vsup) :
- 1.14V
- Package / Case :
- 325-TFBGA, CSPBGA
- RAM Size :
- 64KB
- Number of Terminations :
- 325
- Primary Attributes :
- FPGA - 60K Logic Modules
- Published :
- 2015
- Supply Voltage-Max (Vsup) :
- 1.26V
- Height Seated (Max) :
- 1.01mm
- JESD-609 Code :
- e3
- Number of Outputs :
- 200
- Width :
- 11mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Power Supplies :
- 1.2V
- Length :
- 11mm
- Packaging :
- Tray
- Flash Size :
- 256KB
- Additional Feature :
- LG-MIN, WD-MIN
- Terminal Position :
- BOTTOM
- Number of Logic Cells :
- 56520
- JESD-30 Code :
- S-PBGA-B325
- RoHS Status :
- RoHS Compliant
- Architecture :
- MCU, FPGA
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Speed :
- 166MHz
- Terminal Finish :
- MATTE TIN
- Terminal Pitch :
- 0.5mm
- Supply Voltage :
- 1.2V
- Core Processor :
- ARM® Cortex®-M3
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Number of Inputs :
- 200
- Series :
- SmartFusion®2
- Factory Lead Time :
- 10 Weeks
- Operating Temperature :
- -40°C~100°C TJ
- Peripherals :
- DDR, PCIe, SERDES
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 3 weeks ago)
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Terminal Form :
- Ball
- Qualification Status :
- Not Qualified
- Number of I/O :
- 200
- Surface Mount :
- yes
- Datasheets
- M2S060T-1FCSG325I
325 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
On this SoC, there is ARM® Cortex®-M3 core processor.Assigned with the package 325-TFBGA, CSPBGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion®2 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 60K Logic Modules.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 200 I/Os.It is recommended to use a 1.2V power supply.In the SoCs wireless, voltages above 1.26V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.In total, there are 325 terminations, which is great for system on a chip.There are 200 outputs available on this SoC.A power supply of 1.2V is required to run system on chip.On the SoC chip, there are 200 inputs available for use.Logic system on chips consist of 56520 logic cells.There is a flash of 256KB on it.Further features of this SoC processor are LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S060T-1FCSG325I System On Chip (SoC) applications.
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
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