M2S060T-1FCSG325

Manufacturer :

Microchip Technology

Product Category :

System On Chip (SoC)

Factory Lead Time :

10 Weeks

Number of Logic Cells :

56520

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Published :

2015

Width :

11mm

Terminal Finish :

MATTE TIN

Lifecycle Status :

IN PRODUCTION (Last Updated: 3 weeks ago)

HTS Code :

8542.39.00.01

Terminal Form :

Ball

JESD-30 Code :

S-PBGA-B325

Number of Outputs :

200

RAM Size :

64KB

Number of I/O :

200

Package / Case :

325-TFBGA, CSPBGA

Terminal Pitch :

0.5mm

Surface Mount :

yes

Peripherals :

DDR, PCIe, SERDES

JESD-609 Code :

e3

Flash Size :

256KB

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Operating Temperature :

0°C~85°C TJ

Core Processor :

ARM® Cortex®-M3

Connectivity :

CANbus, Ethernet, I2C, SPI, UART/USART, USB

Number of Inputs :

200

Number of Terminations :

325

Additional Feature :

LG-MIN, WD-MIN

Length :

11mm

Programmable Logic Type :

FIELD PROGRAMMABLE GATE ARRAY

Packaging :

Tray

Supply Voltage-Max (Vsup) :

1.26V

Qualification Status :

Not Qualified

Height Seated (Max) :

1.01mm

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Supply Voltage :

1.2V

Series :

SmartFusion®2

Architecture :

MCU, FPGA

RoHS Status :

RoHS Compliant

Supply Voltage-Min (Vsup) :

1.14V

Speed :

166MHz

Primary Attributes :

FPGA - 60K Logic Modules

Power Supplies :

1.2V

Terminal Position :

BOTTOM