M2S060T-1FCS325I

Manufacturer :

Microchip Technology

Product Category :

System On Chip (SoC)

Height Seated (Max) :

1.01mm

Power Supplies :

1.2V

JESD-609 Code :

e0

Supply Voltage-Max (Vsup) :

1.26V

Supply Voltage-Min (Vsup) :

1.14V

Core Processor :

ARM® Cortex®-M3

Packaging :

Tray

HTS Code :

8542.39.00.01

Package / Case :

325-TFBGA, CSPBGA

Primary Attributes :

FPGA - 60K Logic Modules

Number of Inputs :

200

Number of Terminations :

325

Terminal Finish :

Tin/Lead (Sn/Pb)

Additional Feature :

LG-MIN, WD-MIN

Series :

SmartFusion®2

Surface Mount :

yes

Lifecycle Status :

IN PRODUCTION (Last Updated: 3 weeks ago)

Qualification Status :

Not Qualified

RAM Size :

64KB

Operating Temperature :

-40°C~100°C TJ

Factory Lead Time :

10 Weeks

Speed :

166MHz

RoHS Status :

Non-RoHS Compliant

Width :

11mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Reach Compliance Code :

not_compliant

Number of Outputs :

200

Peripherals :

DDR, PCIe, SERDES

Programmable Logic Type :

FIELD PROGRAMMABLE GATE ARRAY

Length :

11mm

Supply Voltage :

1.2V

Terminal Pitch :

0.5mm

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Terminal Position :

BOTTOM

JESD-30 Code :

S-PBGA-B325

Connectivity :

CANbus, Ethernet, I2C, SPI, UART/USART, USB

Number of Logic Cells :

56520

Number of I/O :

200

Terminal Form :

Ball

Flash Size :

256KB

Architecture :

MCU, FPGA

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED