M2S060-VFG400
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- Mfr.Part #
- M2S060-VFG400
- Manufacturer
- Microchip Technology
- Package / Case
- 400-LFBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 400VFBGA
- Stock
- 36,842
- In Stock ：
- 36,842
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Surface Mount :
- yes
- Supply Voltage-Min (Vsup) :
- 1.14V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Power Supplies :
- 1.2V
- Length :
- 17mm
- Number of Logic Cells :
- 56520
- Published :
- 2015
- Number of I/O :
- 207
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Primary Attributes :
- FPGA - 60K Logic Modules
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 2 weeks ago)
- Supply Voltage-Max (Vsup) :
- 1.26V
- Number of Outputs :
- 207
- Height Seated (Max) :
- 1.51mm
- Terminal Form :
- Ball
- Qualification Status :
- Not Qualified
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of Inputs :
- 207
- Speed :
- 166MHz
- JESD-609 Code :
- e3
- Supply Voltage :
- 1.2V
- Factory Lead Time :
- 11 Weeks
- Package / Case :
- 400-LFBGA
- Peripherals :
- DDR, PCIe, SERDES
- Flash Size :
- 256KB
- Architecture :
- MCU, FPGA
- Operating Temperature :
- 0°C~85°C TJ
- Core Processor :
- ARM® Cortex®-M3
- HTS Code :
- 8542.39.00.01
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Terminations :
- 400
- Terminal Pitch :
- 0.8mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RoHS Status :
- RoHS Compliant
- Packaging :
- Tray
- Terminal Finish :
- MATTE TIN
- Width :
- 17mm
- RAM Size :
- 64KB
- Series :
- SmartFusion®2
- JESD-30 Code :
- S-PBGA-B400
- Terminal Position :
- BOTTOM
- Datasheets
- M2S060-VFG400
400 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 207 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 400-LFBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion®2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 60K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 207 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.14V, it should be able to function.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 400 terminations.This SoC chip is capable of having 207 outputs, which is convenient.There is 1.2V power supply requirement for this system on chip SoC.The SoC chip offers 207 inputs.System on chips of logic are comprised of 56520 logic cells.This flash has a size of 256KB.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060-VFG400 System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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