M2S060-1FCSG325
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- Mfr.Part #
- M2S060-1FCSG325
- Manufacturer
- Microchip Technology
- Package / Case
- 325-TFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 325BGA
- Stock
- 40,448
- In Stock ：
- 40,448
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Width :
- 11mm
- Height Seated (Max) :
- 1.01mm
- Number of Inputs :
- 200
- Factory Lead Time :
- 10 Weeks
- Number of Logic Cells :
- 56520
- RoHS Status :
- RoHS Compliant
- Power Supplies :
- 1.2V
- Peripherals :
- DDR, PCIe, SERDES
- RAM Size :
- 64KB
- Supply Voltage-Max (Vsup) :
- 1.26V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Series :
- SmartFusion®2
- Terminal Form :
- Ball
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 2 weeks ago)
- JESD-609 Code :
- e3
- Length :
- 11mm
- Terminal Position :
- BOTTOM
- Published :
- 2015
- Supply Voltage-Min (Vsup) :
- 1.14V
- Primary Attributes :
- FPGA - 60K Logic Modules
- Supply Voltage :
- 1.2V
- Qualification Status :
- Not Qualified
- Terminal Finish :
- MATTE TIN
- Number of Outputs :
- 200
- Operating Temperature :
- -40°C~100°C TJ
- Number of I/O :
- 200
- Architecture :
- MCU, FPGA
- Surface Mount :
- yes
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Packaging :
- Tray
- Additional Feature :
- LG-MIN, WD-MIN
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Speed :
- 166MHz
- Flash Size :
- 256KB
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Core Processor :
- ARM® Cortex®-M3
- Number of Terminations :
- 325
- JESD-30 Code :
- S-PBGA-B325
- HTS Code :
- 8542.39.00.01
- Terminal Pitch :
- 0.5mm
- Package / Case :
- 325-TFBGA, CSPBGA
- Datasheets
- M2S060-1FCSG325
325 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 325-TFBGA, CSPBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion®2 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines FPGA - 60K Logic Modules is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 200 I/Os.Use a power supply with a voltage of 1.2V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.26V.Power supplies of at least 1.14V are required.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A system on a chip benefits from having 325 terminations.A SoC chip like this can have 200 outputs.In order to operate system on chip, you will need 1.2V power supplies.This SoC chip has a total of 200 inputs that can be used.The logic SoC features 56520 logic cells.A flashing 256KB appears on it.This SoC processor also includes LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S060-1FCSG325I System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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