M2S050T-1FCSG325I
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- Mfr.Part #
- M2S050T-1FCSG325I
- Manufacturer
- Microchip Technology
- Package / Case
- 325-TFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 325BGA
- Stock
- 39,726
- In Stock ：
- 39,726
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Width :
- 11mm
- Surface Mount :
- yes
- JESD-609 Code :
- e3
- Peripherals :
- DDR, PCIe, SERDES
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 2 weeks ago)
- JESD-30 Code :
- S-PBGA-B325
- Architecture :
- MCU, FPGA
- Terminal Finish :
- MATTE TIN
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of I/O :
- 200
- Terminal Position :
- BOTTOM
- RAM Size :
- 64KB
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Additional Feature :
- LG-MIN, WD-MIN
- Package / Case :
- 325-TFBGA, CSPBGA
- Supply Voltage :
- 1.2V
- Number of Inputs :
- 200
- Number of Outputs :
- 200
- Flash Size :
- 256KB
- Number of Terminations :
- 325
- Number of Logic Cells :
- 56340
- Supply Voltage-Max (Vsup) :
- 1.26V
- Speed :
- 166MHz
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- RoHS Status :
- RoHS Compliant
- Operating Temperature :
- -40°C~100°C TJ
- Length :
- 11mm
- Primary Attributes :
- FPGA - 50K Logic Modules
- Series :
- SmartFusion®2
- Packaging :
- Tray
- Power Supplies :
- 1.2V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Terminal Pitch :
- 0.5mm
- HTS Code :
- 8542.39.00.01
- Terminal Form :
- Ball
- Qualification Status :
- Not Qualified
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Height Seated (Max) :
- 1.01mm
- Factory Lead Time :
- 10 Weeks
- Core Processor :
- ARM® Cortex®-M3
- Supply Voltage-Min (Vsup) :
- 1.14V
- Datasheets
- M2S050T-1FCSG325I
325 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 325-TFBGA, CSPBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 50K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.200 I/Os are included in this SoC part.A 1.2V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.At least 1.14V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 325 terminations, which makes system on a chip possible.A SoC chip with 200 outputs is available.A power supply of 1.2V is required.A SoC chip with 200 inputs is available.A logic SoC has 56340 logic cells.A 256KB flash can be seen on it.Aside from that, this SoC processor features LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S050T-1FCSG325I System On Chip (SoC) applications.
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
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