M2S050-1FCSG325
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- Mfr.Part #
- M2S050-1FCSG325
- Manufacturer
- Microchip Technology
- Package / Case
- 325-TFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 325BGA
- Stock
- 46,063
- In Stock ：
- 46,063
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Number of Terminations :
- 325
- Supply Voltage-Max (Vsup) :
- 1.26V
- Terminal Pitch :
- 0.5mm
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Lead Free :
- Lead Free
- Power Supplies :
- 1.2V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Additional Feature :
- LG-MIN, WD-MIN
- Operating Temperature :
- -40°C~100°C TJ
- Published :
- 2015
- Supply Voltage :
- 1.2V
- Series :
- SmartFusion®2
- Supply Voltage-Min (Vsup) :
- 1.14V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of I/O :
- 200
- JESD-609 Code :
- e3
- Number of Outputs :
- 200
- Surface Mount :
- yes
- HTS Code :
- 8542.39.00.01
- ECCN Code :
- 3A991.D
- Width :
- 11mm
- Number of Logic Cells :
- 56340
- RoHS Status :
- RoHS Compliant
- Terminal Position :
- BOTTOM
- RAM Size :
- 64KB
- Height Seated (Max) :
- 1.01mm
- Packaging :
- Tray
- JESD-30 Code :
- S-PBGA-B325
- Primary Attributes :
- FPGA - 50K Logic Modules
- Length :
- 11mm
- Package / Case :
- 325-TFBGA, CSPBGA
- Flash Size :
- 256KB
- Core Processor :
- ARM® Cortex®-M3
- Speed :
- 166MHz
- Architecture :
- MCU, FPGA
- Qualification Status :
- Not Qualified
- Factory Lead Time :
- 10 Weeks
- Terminal Form :
- Ball
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Finish :
- MATTE TIN
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 2 weeks ago)
- Number of Inputs :
- 200
- Peripherals :
- DDR, PCIe, SERDES
- Datasheets
- M2S050-1FCSG325
325 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor ARM® Cortex®-M3 is embedded in this SoC.It has been assigned a package 325-TFBGA, CSPBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion®2 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines FPGA - 50K Logic Modules and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 200 I/Os in total.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.As a result, there are 325 terminations in total, which does really benefit system on a chip.The SoC chip that comes with this module can be configured to have 200 outputs.In order to use system on chip, you will need a power supply of 1.2V.This SoC chip is equipped with 200 inputs for the user to choose from.The logic system on chips contain 56340 logic cells.This flash has a size of 256KB.Moreover, this SoC processor is also equipped with additional features of LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S050-1FCSG325I System On Chip (SoC) applications.
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
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