M2S050-1FCS325I
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- Mfr.Part #
- M2S050-1FCS325I
- Manufacturer
- Microchip Technology
- Package / Case
- 325-TFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 325BGA
- Stock
- 1,101
- In Stock ：
- 1,101
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Number of Terminations :
- 325
- Supply Voltage :
- 1.2V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Pitch :
- 0.5mm
- Additional Feature :
- LG-MIN, WD-MIN
- JESD-609 Code :
- e0
- Package / Case :
- 325-TFBGA, CSPBGA
- Supply Voltage-Min (Vsup) :
- 1.14V
- RoHS Status :
- Non-RoHS Compliant
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 3 weeks ago)
- HTS Code :
- 8542.39.00.01
- Primary Attributes :
- FPGA - 50K Logic Modules
- Number of I/O :
- 200
- Factory Lead Time :
- 10 Weeks
- Core Processor :
- ARM® Cortex®-M3
- Number of Outputs :
- 200
- Length :
- 11mm
- Width :
- 11mm
- Speed :
- 166MHz
- Packaging :
- Tray
- Number of Inputs :
- 200
- Terminal Position :
- BOTTOM
- Flash Size :
- 256KB
- Operating Temperature :
- -40°C~100°C TJ
- Architecture :
- MCU, FPGA
- Terminal Form :
- Ball
- Series :
- SmartFusion®2
- Peripherals :
- DDR, PCIe, SERDES
- Supply Voltage-Max (Vsup) :
- 1.26V
- Qualification Status :
- Not Qualified
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Power Supplies :
- 1.2V
- RAM Size :
- 64KB
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- JESD-30 Code :
- S-PBGA-B325
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Number of Logic Cells :
- 56340
- Reach Compliance Code :
- not_compliant
- Height Seated (Max) :
- 1.01mm
- Surface Mount :
- yes
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Datasheets
- M2S050-1FCS325I
325 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 325-TFBGA, CSPBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion®2 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines FPGA - 50K Logic Modules is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 200 I/Os.Use a power supply with a voltage of 1.2V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.26V.Power supplies of at least 1.14V are required.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A system on a chip benefits from having 325 terminations.A SoC chip like this can have 200 outputs.In order to operate system on chip, you will need 1.2V power supplies.This SoC chip has a total of 200 inputs that can be used.The logic SoC features 56340 logic cells.A flashing 256KB appears on it.This SoC processor also includes LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S050-1FCS325I System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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