M2S050-1FCS325
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- Mfr.Part #
- M2S050-1FCS325
- Manufacturer
- Microchip Technology
- Package / Case
- 325-TFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 325BGA
- Stock
- 9,121
- In Stock ：
- 9,121
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Power Supplies :
- 1.2V
- Packaging :
- Tray
- Primary Attributes :
- FPGA - 50K Logic Modules
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Supply Voltage-Min (Vsup) :
- 1.14V
- RAM Size :
- 64KB
- Terminal Form :
- Ball
- Factory Lead Time :
- 10 Weeks
- Number of I/O :
- 200
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Reach Compliance Code :
- not_compliant
- Flash Size :
- 256KB
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 2 weeks ago)
- Architecture :
- MCU, FPGA
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Core Processor :
- ARM® Cortex®-M3
- Terminal Position :
- BOTTOM
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Logic Cells :
- 56340
- RoHS Status :
- Non-RoHS Compliant
- Additional Feature :
- LG-MIN, WD-MIN
- Published :
- 2015
- Height Seated (Max) :
- 1.01mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Pitch :
- 0.5mm
- Speed :
- 166MHz
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- JESD-609 Code :
- e0
- HTS Code :
- 8542.39.00.01
- JESD-30 Code :
- S-PBGA-B325
- Number of Outputs :
- 200
- Operating Temperature :
- 0°C~85°C TJ
- Peripherals :
- DDR, PCIe, SERDES
- Length :
- 11mm
- Package / Case :
- 325-TFBGA, CSPBGA
- Width :
- 11mm
- Number of Terminations :
- 325
- Surface Mount :
- yes
- Supply Voltage :
- 1.2V
- Series :
- SmartFusion®2
- Number of Inputs :
- 200
- Qualification Status :
- Not Qualified
- Supply Voltage-Max (Vsup) :
- 1.26V
- Datasheets
- M2S050-1FCS325
325 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package as per the manufacturer's specifications.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion®2 series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.As one of the most important things to note is that this SoC security combines FPGA - 50K Logic Modules together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 200 I/Os.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.In order to run it, it must be fed by at least 1.14V of power.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip uses 325 terminations in total.In order for this SoC chip to work properly, you can have 200 outputs.This system on chip SoC requires 1.2V power supply at all.The SoC chip is equipped with 200 inputs.In logic system on chips, there are 56340 logic cells.As for its flash size, it is 256KB.Furthermore, this SoC processor also incorporates additional features similar to LG-MIN, WD-MIN which are available on other SoC processors also.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S050-1FCS325 System On Chip (SoC) applications.
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
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