M2S050-1FCS325
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- Mfr.Part #
- M2S050-1FCS325
- Manufacturer
- Microchip Technology
- Package / Case
- 325-TFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 325BGA
- Stock
- 9,121
- In Stock ：
- 9,121
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Number of I/O :
- 200
- Length :
- 11mm
- HTS Code :
- 8542.39.00.01
- Number of Terminations :
- 325
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Width :
- 11mm
- Supply Voltage :
- 1.2V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Position :
- BOTTOM
- Package / Case :
- 325-TFBGA, CSPBGA
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Supply Voltage-Max (Vsup) :
- 1.26V
- Speed :
- 166MHz
- Additional Feature :
- LG-MIN, WD-MIN
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- RAM Size :
- 64KB
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Published :
- 2015
- Supply Voltage-Min (Vsup) :
- 1.14V
- JESD-30 Code :
- S-PBGA-B325
- Flash Size :
- 256KB
- Primary Attributes :
- FPGA - 50K Logic Modules
- Core Processor :
- ARM® Cortex®-M3
- Surface Mount :
- yes
- Series :
- SmartFusion®2
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- JESD-609 Code :
- e0
- Factory Lead Time :
- 10 Weeks
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 2 weeks ago)
- Number of Inputs :
- 200
- Peripherals :
- DDR, PCIe, SERDES
- Number of Logic Cells :
- 56340
- Number of Outputs :
- 200
- Qualification Status :
- Not Qualified
- Height Seated (Max) :
- 1.01mm
- Packaging :
- Tray
- Power Supplies :
- 1.2V
- Terminal Form :
- Ball
- Reach Compliance Code :
- not_compliant
- RoHS Status :
- Non-RoHS Compliant
- Terminal Pitch :
- 0.5mm
- Architecture :
- MCU, FPGA
- Operating Temperature :
- 0°C~85°C TJ
- Datasheets
- M2S050-1FCS325
325 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package as per the manufacturer's specifications.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion®2 series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.As one of the most important things to note is that this SoC security combines FPGA - 50K Logic Modules together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 200 I/Os.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.In order to run it, it must be fed by at least 1.14V of power.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip uses 325 terminations in total.In order for this SoC chip to work properly, you can have 200 outputs.This system on chip SoC requires 1.2V power supply at all.The SoC chip is equipped with 200 inputs.In logic system on chips, there are 56340 logic cells.As for its flash size, it is 256KB.Furthermore, this SoC processor also incorporates additional features similar to LG-MIN, WD-MIN which are available on other SoC processors also.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S050-1FCS325 System On Chip (SoC) applications.
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
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