M2S025TS-1FCS325

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Mfr.Part #
M2S025TS-1FCS325
Manufacturer
Microchip Technology
Package / Case
325-TFBGA, CSPBGA
Datasheet
Download
Description
IC SOC CORTEX-M3 166MHZ 325BGA
Stock
10,654
In Stock :
10,654

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Manufacturer :
Microchip Technology
Product Category :
System On Chip (SoC)
Packaging :
Tray
Surface Mount :
yes
Terminal Form :
Ball
Height Seated (Max) :
1.01mm
Number of Logic Cells :
27696
Factory Lead Time :
10 Weeks
Terminal Pitch :
0.5mm
Core Processor :
ARM® Cortex®-M3
Series :
SmartFusion®2
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Connectivity :
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Published :
2015
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Supply Voltage :
1.2V
Number of Terminations :
325
Number of Inputs :
180
Terminal Finish :
Tin/Lead (Sn/Pb)
Architecture :
MCU, FPGA
Peripherals :
DDR, PCIe, SERDES
JESD-30 Code :
S-PBGA-B325
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of Outputs :
180
RAM Size :
64KB
Number of I/O :
180
RoHS Status :
Non-RoHS Compliant
Operating Temperature :
0°C~85°C TJ
Additional Feature :
LG-MIN, WD-MIN
Reach Compliance Code :
not_compliant
Terminal Position :
BOTTOM
Speed :
166MHz
Primary Attributes :
FPGA - 25K Logic Modules
Supply Voltage-Min (Vsup) :
1.14V
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Power Supplies :
1.2V
Length :
11mm
Qualification Status :
Not Qualified
Package / Case :
325-TFBGA, CSPBGA
Supply Voltage-Max (Vsup) :
1.26V
JESD-609 Code :
e0
HTS Code :
8542.39.00.01
Flash Size :
256KB
Lifecycle Status :
IN PRODUCTION (Last Updated: 2 weeks ago)
Width :
11mm
Datasheets
M2S025TS-1FCS325
Introducing System On Chip (SoC) Microchip Technology M2S025TS-1FCS325 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:325, Operating Temperature:0°C~85°C TJ, Package / Case:325-TFBGA, CSPBGA, M2S025TS-1FCS325 pinout, M2S025TS-1FCS325 datasheet PDF, M2S025TS-1FCS325 amp .Beyond System On Chip (SoC) Microchip Technology M2S025TS-1FCS325 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology M2S025TS-1FCS325


325 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 180 I/O 1.2V

This SoC is built on ARM® Cortex®-M3 core processor(s).


A core processor ARM® Cortex®-M3 is embedded in this SoC.It has been assigned a package 325-TFBGA, CSPBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion®2 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.This SoC security combines FPGA - 25K Logic Modules and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 180 I/Os in total.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.As a result, there are 325 terminations in total, which does really benefit system on a chip.The SoC chip that comes with this module can be configured to have 180 outputs.In order to use system on chip, you will need a power supply of 1.2V.This SoC chip is equipped with 180 inputs for the user to choose from.The logic system on chips contain 27696 logic cells.This flash has a size of 256KB.Moreover, this SoC processor is also equipped with additional features of LG-MIN, WD-MIN.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN


There are a lot of Microsemi Corporation


M2S025TS-1FCS325 System On Chip (SoC) applications.


  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
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