M2S025T-1FCS325
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- Mfr.Part #
- M2S025T-1FCS325
- Manufacturer
- Microchip Technology
- Package / Case
- 325-TFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 325BGA
- Stock
- 46,107
- In Stock ：
- 46,107
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Additional Feature :
- LG-MIN, WD-MIN
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Width :
- 11mm
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Height Seated (Max) :
- 1.01mm
- Supply Voltage :
- 1.2V
- RAM Size :
- 64KB
- Peripherals :
- DDR, PCIe, SERDES
- Supply Voltage-Min (Vsup) :
- 1.14V
- HTS Code :
- 8542.39.00.01
- JESD-609 Code :
- e0
- Series :
- SmartFusion®2
- Terminal Pitch :
- 0.5mm
- Operating Temperature :
- 0°C~85°C TJ
- Packaging :
- Tray
- Core Processor :
- ARM® Cortex®-M3
- Reach Compliance Code :
- not_compliant
- Qualification Status :
- Not Qualified
- Flash Size :
- 256KB
- Terminal Form :
- Ball
- Number of Outputs :
- 180
- Number of Inputs :
- 180
- Number of Logic Cells :
- 27696
- Number of I/O :
- 180
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Terminal Position :
- BOTTOM
- JESD-30 Code :
- S-PBGA-B325
- Factory Lead Time :
- 10 Weeks
- Surface Mount :
- yes
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Length :
- 11mm
- Speed :
- 166MHz
- Package / Case :
- 325-TFBGA, CSPBGA
- Power Supplies :
- 1.2V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Primary Attributes :
- FPGA - 25K Logic Modules
- RoHS Status :
- Non-RoHS Compliant
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Supply Voltage-Max (Vsup) :
- 1.26V
- Architecture :
- MCU, FPGA
- Number of Terminations :
- 325
- Datasheets
- M2S025T-1FCS325
325 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 180 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
On this SoC, there is ARM® Cortex®-M3 core processor.Assigned with the package 325-TFBGA, CSPBGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion®2 series.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 25K Logic Modules.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 180 I/Os.It is recommended to use a 1.2V power supply.In the SoCs wireless, voltages above 1.26V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.In total, there are 325 terminations, which is great for system on a chip.There are 180 outputs available on this SoC.A power supply of 1.2V is required to run system on chip.On the SoC chip, there are 180 inputs available for use.Logic system on chips consist of 27696 logic cells.There is a flash of 256KB on it.Further features of this SoC processor are LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025T-1FCS325 System On Chip (SoC) applications.
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
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